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Over the past three decades, societal demands have resulted in
extremely compact yet powerful electronic devices. Due to increased
packaging density, improved performance of electronic devices has
caused continuing increase in power dissipation of systems. Hence,
effective thermal management or cooling of the electronic devices
is a key to ensure their reliable and efficient performance.
Considering the limitation of air-cooling method, other cooling
techniques have to be carried out to meet the requirement. Several
new approaches for electronic cooling were proposed and
investigated numerically and experimentally in this book. The
methods include introduction of tree-shaped microchannel network in
heat sink designs, addition of phase change materials, and use of
nanofluids. Results demonstrated that the new approaches have high
potential in thermal management of micro-electronic components.
This work contributes to a more fundamental understanding of the
three methods to improve current state-of-the-art electronic
cooling management.
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