The International Thermal Expansion Symposium was started in 1968 with the initiative of Messrs. R. K. Kirby and P. S. Gaa1. These Symposia cover the deve10pments and advances in theoretica1 and experimental studies of the thermal expansion of so lids and its relation to other re1ated properties, and provide a broad1y based forum for researchers active1y working in this fie1d to convene on a regular basis to exchange their ideas and experiences and report their findings and resu1ts. The Symposia have been se1f-perpetuating and are an examp1e of how a technica1 community with a common purpose can transcend the invisible artificia1 barriers between discip1ines and gather togeth- er in increasing numbers without the need of national publicity and continuing funding support, when they see something worthwhi1e going on. Of the first five Symposia on1y three pub1ished formal Pro- ceedings. However, effective with the Sixth Symposium in 1977 when our Center for Information and Numerica1 Data Analysis and Synthesis (CINDAS) of Purdue University became the permanent Spon- sor of the Symposia, a po1icy of pub1ishing formal Proceedings on a continuipg and uniform basis has been estab1ished. Thus, inc1ud- ing the present vo1ume, the fo110wing formal Proceedings have been pub1ished: Publisher Symposium Tit1e of Vo1ume and Year and Year 2nd SYMPOSIUM ON THERMAL EXPANSION OF American Institute SOLIDS, Journal of App1ied Physics, of Physics (1970) (1970) 41 (13), pp. 5043-5154 American Institute 3rd THERMAL EXPANSION - 1971 of Physics (1972) (1971) AlP Conference Proceedings No.

The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. C. F. Lucks and grew out of the needs of researchers in the field. From 1961 to 1973 the Confer ences were held annually, and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the permanent Spon sor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conductivity and closely related properties to convene on a regular basis to ex change their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather togeth er in increasing numbers without the need of national publicity and continuing funding support, when they see something worthwi1e going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for researchers in other fields on how to jointly attack their own problem areas."