The influence of International Financial Reporting Standards (IFRS) on accounting across the world is stronger than ever. Most importantly, this stems from the mandatory adoption of IFRSs in many parts of the world, including Europe, Canada, Australia, Brazil and, with some relatively small exceptions, China. Additionally, foreign registrants in the US are also permitted to use IFRS by the SEC. The impact of IFRSs also extends to accounting developments as the IASB and the FASB work closely together to formulate new standards such as those recently issued on leasing and revenue recognition. It is clear that investors, analysts and valuers need to understand financial statements produced under IFRS to feed in to their valuations and broader investment decisions. Written by practitioners for practitioners, the book addresses valuation from the viewpoint of the analyst, the investor and the corporate acquirer. It starts with valuation theory: what is to be discounted and at what discount rate? It explains the connection between standard methodologies based on free cash flow and on return on capital. And it emphasizes that, whichever method is used, accurate interpretation of accounting information is critical to the production of sensible valuations. The authors argue that forecasts of cash flows imply views on profits and balance sheets, and that non-cash items contain useful information about future cash flows - so profits matter. The book addresses the implications for analysis, modelling and valuation of key aspects of IFRS, all updated for recent developments, including: - Pensions - Stock options - Derivatives - Provisions - Leases - Revenue recognition - Foreign currency The text also sets out the key differences between IFRS and US GAAP treatments of these issues, in addition to their implications for analysis. A detailed case study is used to provide a step-by-step valuation of an industrial company using both free cash flow and economic profit methodologies. The authors then address a range of common valuation problems, including cyclical or immature companies, as well as the specialist accounting and modelling knowledge required for regulated utilities, resource extraction companies, banks, insurance companies, real estate companies and technology companies. Accounting for mergers and disposals is first explained and then illustrated with a detailed potential acquisition.

Physics of Thin Films is one of the longest running continuing series in thin film science, consisting of 25 volumes since 1963. The series contains quality studies of the properties of various thin films materials and systems. In order to be able to reflect the development of today's science and to cover all modern aspects of thin films, the series, starting with Volume 20, has moved beyond the basic physics of thin films. It now addresses the most important aspects of both inorganic and organic thin films, in both their theoretical and their technological aspects.
Starting with Volume 30, the title of the series, Thin Films, is being changed to Thin Films and Nanostructures. We feel that this new title
reflects more accurately the rapidly growing inclusion of research and
development efforts on nanostructures, especially in relation to novel
solid-state device formats

The highly industrialized world we live in depends for its survival and further growth on advanced electronic technologies which place a premium on rapidly improved performance versus size, weight, and cost. Small computers, high-definition TV, digital camcorders, flat-panel displays, and robotic systems are but a few examples of miniatured device technologies which are of critical importance to emerging societal, industrial, defense, and space needs. All of these technologies depend sensitively on the availability of miniature thin film components in array and/or integrated formats. This book provides that first multi-topical coverage of the semiconductor, optical, superconductor, magnetic, and ferroelectric devices and technologies responding to these needs.
This book comprises five topical volumes edited by world authorities in their fields, i.e. semiconductor junction devices, semiconductor optics, superconducting film devices, magnetic film devices, and ferroelectric film devices. Well-known experts were invited to cover recent progress in aspects ranging from deposition and fabrication to device modeling, measurements, and new cutting-edge design approached for improved performance. This multitopic approach effectively demonstrates the broad-based and pervasive character of thin film techniques that impact and control a vast array of device functions that are critical to developments in computer technology, communications, television, defense and space systems, and industrial and consumer products. Readers are provided with both broad critical overviews and research level analysis and technical details.
Key Features
* A comprehensive discussion of the most promising andcompletely developed of thin film devices which impact the entire field of high-tech components and systems for commercial, defense and space applications
* Edited and written by internationally known, authoritative experts and innovators, familiar with all aspects of research and development in their fields and with current and potential applications
* Presents the reader with informed assessments of all candidate solid state film devices now being optimized for advanced application, e.g., in flat panel displays, solar energy conversion, high-speed and power components, radar technology, infrared imaging, advanced computers, laser sources, and numerous other arenas
* Provides a well-balanced coverage of materials growth and optimization, thin-film device modelling, device fabrication and characterization, and future development directions;These inputs are critically important to both educators, designers, device technologists and manufacturers, and to system engineers
* Furnishes useful insights on processing compatibility, materials and film device stability, interface engineering, cryogenic requirements and operation, lithography and micro-machining, and integrability for sub-systems
* Provides a broad-based view of alternative and/or complimentary film device technologies in a single, well-referenced source
* Ensures complete and detailed overview of solid-state device topics, comprehensive bibliographical information, and expert guidance in advanced and sophisticated areas of device technology and potental applications
* Furnishes invaluable insights on competitive state-of-the-art thin film semiconductor, photonics, superconductor, magnetic and ferroelectrictechnologies, processing and compatibility, device options, performance potential and prospects for essentially all solid-state film components
* An essential information source and primer for educators, researchers, engineers and technology leaders supplying a wealth of background theoretical and experimental details, as well as guidance for further advanced research and development, thesis topics and high-tech product design
* Identifies key processing, fabrication, design, integration, compatibility problems and solutions involved in successful development of high-performance and stable device and sub-system architectures