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This book describes the PREMISS system, which enables readers to
overcome the limitations of state-of-the-art battery-less wireless
sensors in size, cost, robustness and range, with a system concept
for a 60 GHz wireless sensor system with monolithic sensors. The
authors demonstrate a system in which the wireless sensors consist
of wireless power receiving, sensing and communication functions in
a single chip, without external components, avoiding costly
IC-interfaces that are sensitive to mechanical and thermal stress.
This book presents the cross-layer design and optimization of
wake-up receivers for wireless body area networks (WBAN), with an
emphasis on low-power circuit design. This includes the analysis of
medium access control (MAC) protocols, mixer-first receiver design,
and implications of receiver impairments on wideband
frequency-shift-keying (FSK) receivers. Readers will learn how the
overall power consumption is reduced by exploiting the
characteristics of body area networks. Theoretical models presented
are validated with two different receiver implementations, in 90nm
and 40nm CMOS technology.
This book presents the cross-layer design and optimization of
wake-up receivers for wireless body area networks (WBAN), with an
emphasis on low-power circuit design. This includes the analysis of
medium access control (MAC) protocols, mixer-first receiver design,
and implications of receiver impairments on wideband
frequency-shift-keying (FSK) receivers. Readers will learn how the
overall power consumption is reduced by exploiting the
characteristics of body area networks. Theoretical models presented
are validated with two different receiver implementations, in 90nm
and 40nm CMOS technology.
This book describes the PREMISS system, which enables readers to
overcome the limitations of state-of-the-art battery-less wireless
sensors in size, cost, robustness and range, with a system concept
for a 60 GHz wireless sensor system with monolithic sensors. The
authors demonstrate a system in which the wireless sensors consist
of wireless power receiving, sensing and communication functions in
a single chip, without external components, avoiding costly
IC-interfaces that are sensitive to mechanical and thermal stress.
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