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This book provides an up to date survey of the state of the art
of research into the materials used in information technology, and
will be bought by researchers in universities, institutions as well
as research workers in the semiconductor and IT industries.
Euromat is the biennial meeting of the Federation of European
Materials Societies (FEMS) constituted by its 24 member societies
in Europe. The 2003 meeting took place in Lausanne, Switzerland,
and was organised by the French, German and Swiss member societies:
Societe Francaise de Metallurgie et de Materiaux (SF2M) Deutsche
Gesellschaft fur Materialkunde (DGM) Schweizerischer Verband fur
die Materialtechnik (SVMT) The scientific programme of the EUROMAT
2003 congress was divided into 15 topics that in turn were
substructured into 47 symposia. The present volume of the Euromat
Publication series refers to selected papers of the Topic A:
Materials for Information Technology Peter Paul Schepp Conference
Organiser of EUROMAT 2003 Preface Information technology (IT) is
driving the need for research, development and - troduction of new
materials and concepts for applications requiring significantly
increased electrical and optical functionality. In particular,
microelectronic pr- ucts must be improved continuously to meet
performance demands while mainta- ing acceptable levels of
reliability. For the semiconductor industry, the challenges to
process technology and advanced materials are outlined in the
International Technology Roadmap for Semiconductors (ITRS).
Microelectronic and, in the longer term, nanoelectronic products of
future technology generations rely on - vanced materials for the
so-called front-end-of-line and back-end-of-line processes on the
waferlevel (die level) as well as for assembly and packaging. More
than ever before, the dramatic productivity enhancement of the IT
era will only be p- sible using advanced materials. Transistor and
interconnect scaling has brought microelectronics a long way."
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