This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to "Critical Heat Flux in Flow Boiling in Micro channels," by the same author team, this volume is idea for professionals, researchers and graduate students concerned with electronic cooling.

This Brief addresses the phenomena of instability in flow boiling in microchannels occurring in high heat flux electronic cooling. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to "Critical Heat Flux in Flow Boiling in Microchannels," and "Heat Transfer and Pressure Drop in Flow Boiling in Microchannels,"by the same author team, this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.

This Brief concerns the important problem of critical heat flux in flow boiling in microchannels. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to "Heat Transfer and Pressure Drop in Flow Boiling in Microchannels," by the same author team, this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.

This is the first book in the new Thermal and Fluid Physics and Engineering series, edited by Professor G. F. Hewitt. This volume, edited by Professor G. P. Celata, explores microchannels. Microchannels have a range of applications, particularly in the context of cooling of electronic equipment. The book fills a void in the existing literature and covers a large body of new knowledge in the thermal-fluid dynamics theory and applications in micro-geometries. The volume also presents a critical assessment of the state-of-the-art in the field. Intended for both academic and industrial audiences.