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Simulated Annealing for VLSI Design (Hardcover, 1988 ed.): D.F. Wong, H.W. Leong, H. W. Liu Simulated Annealing for VLSI Design (Hardcover, 1988 ed.)
D.F. Wong, H.W. Leong, H. W. Liu
R2,766 Discovery Miles 27 660 Ships in 18 - 22 working days

This monograph represents a summary of our work in the last two years in applying the method of simulated annealing to the solution of problems that arise in the physical design of VLSI circuits. Our study is experimental in nature, in that we are con cerned with issues such as solution representations, neighborhood structures, cost functions, approximation schemes, and so on, in order to obtain good design results in a reasonable amount of com putation time. We hope that our experiences with the techniques we employed, some of which indeed bear certain similarities for different problems, could be useful as hints and guides for other researchers in applying the method to the solution of other prob lems. Work reported in this monograph was partially supported by the National Science Foundation under grant MIP 87-03273, by the Semiconductor Research Corporation under contract 87-DP- 109, by a grant from the General Electric Company, and by a grant from the Sandia Laboratories."

Simulated Annealing for VLSI Design (Paperback, Softcover reprint of the original 1st ed. 1988): D.F. Wong, H.W. Leong, H. W.... Simulated Annealing for VLSI Design (Paperback, Softcover reprint of the original 1st ed. 1988)
D.F. Wong, H.W. Leong, H. W. Liu
R2,633 Discovery Miles 26 330 Ships in 18 - 22 working days

This monograph represents a summary of our work in the last two years in applying the method of simulated annealing to the solution of problems that arise in the physical design of VLSI circuits. Our study is experimental in nature, in that we are con cerned with issues such as solution representations, neighborhood structures, cost functions, approximation schemes, and so on, in order to obtain good design results in a reasonable amount of com putation time. We hope that our experiences with the techniques we employed, some of which indeed bear certain similarities for different problems, could be useful as hints and guides for other researchers in applying the method to the solution of other prob lems. Work reported in this monograph was partially supported by the National Science Foundation under grant MIP 87-03273, by the Semiconductor Research Corporation under contract 87-DP- 109, by a grant from the General Electric Company, and by a grant from the Sandia Laboratories."

Fracture Mechanics of Ductile and Tough Materials and Its Applications to Energy Related Structures - Proceedings of the... Fracture Mechanics of Ductile and Tough Materials and Its Applications to Energy Related Structures - Proceedings of the USA-Japan Joint Seminar Held at Hyama, Japan November 12-16, 1979 (Paperback, Softcover reprint of the original 1st ed. 1981)
H. W. Liu; Edited by H. W. Liu, T. Kunio
R1,420 Discovery Miles 14 200 Ships in 18 - 22 working days

This volume contains the proceedings of the USA-Japan Joint Seminar on "Fracture Mechanics of Ductile and Tough Materials and Its Applications to Energy Related Structures". The seminar was supported jointly by the National Science Foundation of the United States and the Japan Society for the Promotion of Sciences. The seminar was held from November 12th to 16th, 1979, at Hayama, Japan, a picturesque resort town by the beach of Sagami Bay facing Mt. Fugi. The safety and integrity of the engineering structures for energy explora tion, energy production, and energy transportation are of utmost importance to our welfare. Both the United States and Japan are at the forefront of the re search on fracture mechanics and its applications to fracture prevention. Dur ing the past few years, major research efforts have been made in the areas of non-linear fracture mechanics and its applications to fracture initiation, slow crack growth, creep and fatigue. This joint seminar offered an unique opportunity for detailed exchange of information on current researches and fu ture efforts.

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