This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in TravemA1/4nde (Baltic Sea), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. Interconnects in VLSI Design addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense Interconnects in VLSI Design represents a continuation and a supplement to the first book, Signal Propagation on Interconnects, Kluwer Academic Publishers, 1998. The papers in Interconnects in VLSI Design cover a wide area of research directions. Apart from describing general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last, but not least, actual problems in the field of optical interconnects.

The contents of this book are an expanded treatment of a set of presentations given at the first IEEE Workshop on Signal Propagation on Interconnects held Trnvemiindc, Germany, May 14- 16, 1997. Traditional VLSI-based cost and complexity measures have principally incolved transistor counts and chip area. Yet with the increase in clock frequency transistor has become an issue of major concern" At present the emergence of systems on silicon feces designers with a new challenge: how to guarantee signal integrity while propagating high signals between embedded cores on a Thus, interconnects are becuming a significant limiter of future system performance. The element~ involved arc mainly transmission lines but also other interconnect devices life vias, and packages" The electrical phenomena that have to investigated, as for example delay and crosstalk, are governed by electromagnetic theory. Consequently, even in digital circuits there large sectians in whieh the can longer considered logical ones and zeros but must be treated as analog waveforms. To complicate matters, the descriptian of subcircuits by ordinary differential eyuations is inadequate in many instsnces. Only the use yartial differential aquations should guarantee sufficiently accurate results. Yet this would unfortunately increase the camplexity af simulatian and besign tremendously" Therefore, new approuuhes need to be developed.

This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book "Signal Propagation on Interconnects," Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects."

The contents of this book are an expanded treatment of a set of presentations given at the first IEEE Workshop on Signal Propagation on Interconnects held Trnvemiindc, Germany, May 14- 16, 1997. Traditional VLSI-based cost and complexity measures have principally incolved transistor counts and chip area. Yet with the increase in clock frequency transistor has become an issue of major concern" At present the emergence of systems on silicon feces designers with a new challenge: how to guarantee signal integrity while propagating high signals between embedded cores on a Thus, interconnects are becuming a significant limiter of future system performance. The element~ involved arc mainly transmission lines but also other interconnect devices life vias, and packages" The electrical phenomena that have to investigated, as for example delay and crosstalk, are governed by electromagnetic theory. Consequently, even in digital circuits there large sectians in whieh the can longer considered logical ones and zeros but must be treated as analog waveforms. To complicate matters, the descriptian of subcircuits by ordinary differential eyuations is inadequate in many instsnces. Only the use yartial differential aquations should guarantee sufficiently accurate results. Yet this would unfortunately increase the camplexity af simulatian and besign tremendously" Therefore, new approuuhes need to be developed.

Die Beriicksichtigung von Leitungseinfliissen auf das Signalverhalten in nachrichtentechni- schen Systemen gewinnt mit der in den letzten Jahren in gro13em Umfange stattfindenden Yerbreitung integrierter (und dabei weitgehend digitaler) Schaltungstechnik eine neue Dimension. Geniigte es vorher, sich hinsichtlich der Betrachtung von Leitungseinfliissen bestenfalls nur auf Yerbindungsleitungen zwischen einzelnen nachrichtentechnischen Gera- ten zu konzentrieren, so stellt sich bei zunehmender Signalverarbeitungsgeschwindigkeit und gleichzeitig wachsender Integrationsdichte elektronischer Schaltungen die Frage, wel- che Einfliisse denn die Leitbahnen innerhalb einzelner Schaltungen und Module auf das Signalverhalten ausiiben und inwieweit diese Einfliisse bereits beim Schaltungsentwurf zu beriicksichtigen sind. Eine entsprechende Entwicklung spiegelt sich auch in der hieriiber verfiigbaren Literatur wider: zwar existiert eine gro13e Anzahl von Biichem iiber Leitungs- theorie, aber die gerade im Zusammenhang mit der Behandlung von Leitbahnen auf inte- grierten Schaltungen, Boards sowie weiteren Tragersubstraten auftretenden spezifischen Probleme wurden bisher, wenn iiberhaupt, nahezu ausschlie13lich in Spezialaufsatzen ange- sprochen. Mit dem vorliegenden Buch wird versucht, diese Liicke zu schlie13en. Zwei Schwierigkeiten stehen bei der Behandlung von Leitungseinfliissen in analogen aber insbesondere in digitalen Schaltungen im Yordergrund. Erstens verfiigt der einzelne Schal- tungsdesigner i. a. noch iiber zu geringe Erfahrungen auf dem insbesondere im Zusammen- hang mit der Signalausbreitung auf Leitbahnen wichtigen Gebiet der Elektrodynamik. Dies fiihrt dazu, daB die simulationstechnische Erfassung von Leitungseinfliissen oft auf recht heuristische Weise erfolgt und insbesondere keine sicheren Kenntnisse dariiber bestehen, ob die dabei getroffenen MaBnahmen die Realitiit tatsachlich hinreichend gut beschreiben.