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This book presents an updated selection of the most representative
contributions to the 2nd and 3rd IEEE Workshops on Signal
Propagation on Interconnects (SPI) which were held in TravemA1/4nde
(Baltic Sea), Germany, May 13-15, 1998, and in Titisee-Neustadt
(Black Forest), Germany, May 19-21, 1999. Interconnects in VLSI
Design addresses the need of developers and researchers in the
field of VLSI chip and package design. It offers a survey of
current problems regarding the influence of interconnect effects on
the electrical performance of electronic circuits and suggests
innovative solutions. In this sense Interconnects in VLSI Design
represents a continuation and a supplement to the first book,
Signal Propagation on Interconnects, Kluwer Academic Publishers,
1998. The papers in Interconnects in VLSI Design cover a wide area
of research directions. Apart from describing general trends they
deal with the solution of signal integrity problems, the modeling
of interconnects, parameter extraction using calculations and
measurements and last, but not least, actual problems in the field
of optical interconnects.
The contents of this book are an expanded treatment of a set of
presentations given at the first IEEE Workshop on Signal
Propagation on Interconnects held Trnvemiindc, Germany, May 14- 16,
1997. Traditional VLSI-based cost and complexity measures have
principally incolved transistor counts and chip area. Yet with the
increase in clock frequency transistor has become an issue of major
concern" At present the emergence of systems on silicon feces
designers with a new challenge: how to guarantee signal integrity
while propagating high signals between embedded cores on a Thus,
interconnects are becuming a significant limiter of future system
performance. The element~ involved arc mainly transmission lines
but also other interconnect devices life vias, and packages" The
electrical phenomena that have to investigated, as for example
delay and crosstalk, are governed by electromagnetic theory.
Consequently, even in digital circuits there large sectians in
whieh the can longer considered logical ones and zeros but must be
treated as analog waveforms. To complicate matters, the descriptian
of subcircuits by ordinary differential eyuations is inadequate in
many instsnces. Only the use yartial differential aquations should
guarantee sufficiently accurate results. Yet this would
unfortunately increase the camplexity af simulatian and besign
tremendously" Therefore, new approuuhes need to be developed.
This book presents an updated selection of the most representative
contributions to the 2nd and 3rd IEEE Workshops on Signal
Propagation on Interconnects (SPI) which were held in Travemtinde
(Baltic See Side), Germany, May 13-15, 1998, and in
Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This
publication addresses the need of developers and researchers in the
field of VLSI chip and package design. It offers a survey of
current problems regarding the influence of interconnect effects on
the electrical performance of electronic circuits and suggests
innovative solutions. In this sense the present book represents a
continua tion and a supplement to the first book "Signal
Propagation on Interconnects," Kluwer Academic Publishers, 1998.
The papers in this book cover a wide area of research directions:
Beneath the des cription of general trends they deal with the
solution of signal integrity problems, the modeling of
interconnects, parameter extraction using calculations and
measurements and last but not least actual problems in the field of
optical interconnects."
The contents of this book are an expanded treatment of a set of
presentations given at the first IEEE Workshop on Signal
Propagation on Interconnects held Trnvemiindc, Germany, May 14- 16,
1997. Traditional VLSI-based cost and complexity measures have
principally incolved transistor counts and chip area. Yet with the
increase in clock frequency transistor has become an issue of major
concern" At present the emergence of systems on silicon feces
designers with a new challenge: how to guarantee signal integrity
while propagating high signals between embedded cores on a Thus,
interconnects are becuming a significant limiter of future system
performance. The element~ involved arc mainly transmission lines
but also other interconnect devices life vias, and packages" The
electrical phenomena that have to investigated, as for example
delay and crosstalk, are governed by electromagnetic theory.
Consequently, even in digital circuits there large sectians in
whieh the can longer considered logical ones and zeros but must be
treated as analog waveforms. To complicate matters, the descriptian
of subcircuits by ordinary differential eyuations is inadequate in
many instsnces. Only the use yartial differential aquations should
guarantee sufficiently accurate results. Yet this would
unfortunately increase the camplexity af simulatian and besign
tremendously" Therefore, new approuuhes need to be developed.
Die Beriicksichtigung von Leitungseinfliissen auf das
Signalverhalten in nachrichtentechni- schen Systemen gewinnt mit
der in den letzten Jahren in gro13em Umfange stattfindenden
Yerbreitung integrierter (und dabei weitgehend digitaler)
Schaltungstechnik eine neue Dimension. Geniigte es vorher, sich
hinsichtlich der Betrachtung von Leitungseinfliissen bestenfalls
nur auf Yerbindungsleitungen zwischen einzelnen
nachrichtentechnischen Gera- ten zu konzentrieren, so stellt sich
bei zunehmender Signalverarbeitungsgeschwindigkeit und gleichzeitig
wachsender Integrationsdichte elektronischer Schaltungen die Frage,
wel- che Einfliisse denn die Leitbahnen innerhalb einzelner
Schaltungen und Module auf das Signalverhalten ausiiben und
inwieweit diese Einfliisse bereits beim Schaltungsentwurf zu
beriicksichtigen sind. Eine entsprechende Entwicklung spiegelt sich
auch in der hieriiber verfiigbaren Literatur wider: zwar existiert
eine gro13e Anzahl von Biichem iiber Leitungs- theorie, aber die
gerade im Zusammenhang mit der Behandlung von Leitbahnen auf inte-
grierten Schaltungen, Boards sowie weiteren Tragersubstraten
auftretenden spezifischen Probleme wurden bisher, wenn iiberhaupt,
nahezu ausschlie13lich in Spezialaufsatzen ange- sprochen. Mit dem
vorliegenden Buch wird versucht, diese Liicke zu schlie13en. Zwei
Schwierigkeiten stehen bei der Behandlung von Leitungseinfliissen
in analogen aber insbesondere in digitalen Schaltungen im
Yordergrund. Erstens verfiigt der einzelne Schal- tungsdesigner i.
a. noch iiber zu geringe Erfahrungen auf dem insbesondere im
Zusammen- hang mit der Signalausbreitung auf Leitbahnen wichtigen
Gebiet der Elektrodynamik. Dies fiihrt dazu, daB die
simulationstechnische Erfassung von Leitungseinfliissen oft auf
recht heuristische Weise erfolgt und insbesondere keine sicheren
Kenntnisse dariiber bestehen, ob die dabei getroffenen MaBnahmen
die Realitiit tatsachlich hinreichend gut beschreiben.
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