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The exploitation of MicroElectroMechanical-Systems for Radio
Frequency applications (RF-MEMS) has been attracting the interest
of the Scientific Community through the past decade, because of its
potentialities in terms of high-performance and large
reconfigurability it can enable in transceiver platform (e.g. in
satellites, radars, mobile phones). This work addresses two
critical issues leading to the successful exploitation of RF-MEMS
technology, namely the modeling of their multi-physical behaviour
(electromechanical and electromagnetic) and the
packaging/encapsulation of such devices to enable their operability
and integration with standard technologies. The first issue is
addressed with the development of MEMS behavioural compact models,
allowing fast and accurate simulations within commercial IC
development frameworks. The packaging issue is treated by
discussing several technology solutions and focusing on the
Wafer-Level-Packaging approach. This book provides the reader with
useful and practical information on the modeling, simulation and
integration of RF-MEMS, and it is particularly suitable for
Scientists, Researchers, Designers and Technologists in the RF-MEMS
field.
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