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Micromachined Ultrasound-Based Proximity Sensors presents a
packaged ultrasound microsystem for object detection and distance
metering based on micromachined silicon transducer elements. It
describes the characterization, optimization and the long-term
stability of silicon membrane resonators as well as appropriate
packaging for ultrasound microsystems. Micromachined
Ultrasound-Based Proximity Sensors describes a cost-effective
approach to the realization of a micro electro mechanical system
(MEMS). The micromachined silicon transducer elements were
fabricated using industrial IC technology combined with standard
silicon micromachining techniques. Additionally, this approach
allows the cointegration of the driving and read-out circuitry. To
ensure the industrial applicability of the fabricated transducer
elements intensive long-term stability and reliability tests were
performed under various environmental conditions such as high
temperature and humidity. Great effort was undertaken to
investigate the packaging and housing of the ultrasound system,
which mainly determine the success or failure of an industrial
microsystem. A low-stress mounting of the transducer element
minimizes thermomechanical stress influences. The developed housing
not only protects the silicon chip but also improves the acoustic
performance of the transducer elements. The developed ultrasound
proximity sensor system can determine object distances up to 10 cm
with an accuracy of better than 0.8 mm. Micromachined
Ultrasound-Based Proximity Sensors will be of interest to MEMS
researchers as well as those involved in solid-state sensor
development.
Micromachined Ultrasound-Based Proximity Sensors presents a
packaged ultrasound microsystem for object detection and distance
metering based on micromachined silicon transducer elements. It
describes the characterization, optimization and the long-term
stability of silicon membrane resonators as well as appropriate
packaging for ultrasound microsystems. Micromachined
Ultrasound-Based Proximity Sensors describes a cost-effective
approach to the realization of a micro electro mechanical system
(MEMS). The micromachined silicon transducer elements were
fabricated using industrial IC technology combined with standard
silicon micromachining techniques. Additionally, this approach
allows the cointegration of the driving and read-out circuitry. To
ensure the industrial applicability of the fabricated transducer
elements intensive long-term stability and reliability tests were
performed under various environmental conditions such as high
temperature and humidity. Great effort was undertaken to
investigate the packaging and housing of the ultrasound system,
which mainly determine the success or failure of an industrial
microsystem. A low-stress mounting of the transducer element
minimizes thermomechanical stress influences. The developed housing
not only protects the silicon chip but also improves the acoustic
performance of the transducer elements. The developed ultrasound
proximity sensor system can determine object distances up to 10 cm
with an accuracy of better than 0.8 mm. Micromachined
Ultrasound-Based Proximity Sensors will be of interest to MEMS
researchers as well as those involved in solid-state sensor
development.
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