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This book contributes to the body of scholarly knowledge by
exploring the main ideas of wireless networks of past, present, and
future, trends in the field of networking, the capabilities of 5G
and technologies that are potential enablers of 6G, potential 6G
applications and requirements, as well as unique challenges and
opportunities that 6G research is going to offer over the next
decade. It covers research topics such as communication via
millimeter-waves, terahertz waves and visible light to enable
faster speeds, as well as research into achieving other basic
requirements of 6G networks. These include low end-to-end latency,
high energy efficiency, coverage that is ubiquitous and always-on,
integration of terrestrial wireless with non-terrestrial networks,
network management that is made more effective by connected
intelligence with machine learning capabilities, as well as support
for the evolution of old service classes and support for new ones.
This peer-reviewed book explores the methodologies that are used
for effective research, design and innovation in the vast field of
millimeter-wave circuits, and describes how these have to be
modified to fit the uniqueness of high-frequency nanoelectronics
design. Each chapter focuses on a specific research challenge
related to either small form factors or higher operating
frequencies. The book first examines nanodevice scaling and the
emerging electronic design automation tools that can be used in
millimeter-wave research, as well as the singular challenges of
combining deep-submicron and millimeter-wave design. It also
demonstrates the importance of considering, in the millimeter-wave
context, system-level design leading to differing packaging
options. Further, it presents integrated circuit design
methodologies for all major transceiver blocks typically employed
at millimeter-wave frequencies, as these methodologies are normally
fundamentally different from the traditional design methodologies
used in analogue and lower-frequency electronics. Lastly, the book
discusses the methodologies of millimeter-wave research and design
for extreme or harsh environments, rebooting electronics, the
additional opportunities for terahertz research, and the main
differences between the approaches taken in millimeter-wave
research and terahertz research.
This book contributes to the body of scholarly knowledge by
exploring the main ideas of wireless networks of past, present, and
future, trends in the field of networking, the capabilities of 5G
and technologies that are potential enablers of 6G, potential 6G
applications and requirements, as well as unique challenges and
opportunities that 6G research is going to offer over the next
decade. It covers research topics such as communication via
millimeter-waves, terahertz waves and visible light to enable
faster speeds, as well as research into achieving other basic
requirements of 6G networks. These include low end-to-end latency,
high energy efficiency, coverage that is ubiquitous and always-on,
integration of terrestrial wireless with non-terrestrial networks,
network management that is made more effective by connected
intelligence with machine learning capabilities, as well as support
for the evolution of old service classes and support for new ones.
This peer-reviewed book explores the methodologies that are used
for effective research, design and innovation in the vast field of
millimeter-wave circuits, and describes how these have to be
modified to fit the uniqueness of high-frequency nanoelectronics
design. Each chapter focuses on a specific research challenge
related to either small form factors or higher operating
frequencies. The book first examines nanodevice scaling and the
emerging electronic design automation tools that can be used in
millimeter-wave research, as well as the singular challenges of
combining deep-submicron and millimeter-wave design. It also
demonstrates the importance of considering, in the millimeter-wave
context, system-level design leading to differing packaging
options. Further, it presents integrated circuit design
methodologies for all major transceiver blocks typically employed
at millimeter-wave frequencies, as these methodologies are normally
fundamentally different from the traditional design methodologies
used in analogue and lower-frequency electronics. Lastly, the book
discusses the methodologies of millimeter-wave research and design
for extreme or harsh environments, rebooting electronics, the
additional opportunities for terahertz research, and the main
differences between the approaches taken in millimeter-wave
research and terahertz research.
This book is the first standalone book that combines research into
low-noise amplifiers (LNAs) with research into millimeter-wave
circuits. In compiling this book, the authors have set two research
objectives. The first is to bring together the research context
behind millimeter-wave circuit operation and the theory of
low-noise amplification. The second is to present new research in
this multi-disciplinary field by dividing the common LNA
configurations and typical specifications into subsystems, which
are then optimized separately to suggest improvements in the
current state-of-the-art designs. To achieve the second research
objective, the state-of-the-art LNA configurations are discussed
and the weaknesses of state-of the art configurations are
considered, thus identifying research gaps. Such research gaps,
among others, point towards optimization - at a systems and
microelectronics level. Optimization topics include the influence
of short wavelength, layout and crosstalk on LNA performance.
Advanced fabrication technologies used to decrease the parasitics
of passive and active devices are also explored, together with
packaging technologies such as silicon-on-chip and
silicon-on-package, which are proposed as alternatives to
traditional IC implementation. This research outcome builds through
innovation. Innovative ideas for LNA construction are explored, and
alternative design methodologies are deployed, including
LNA/antenna co-design or utilization of the electronic design
automation in the research flow. The book also offers the authors'
proposal for streamlined automated LNA design flow, which focuses
on LNA as a collection of highly optimized subsystems.
This book provides a detailed review of power amplifiers, including
classes and topologies rarely covered in books, and supplies
sufficient information to allow the reader to design an entire
amplifier system, and not just the power amplification stage. A
central aim is to furnish readers with ideas on how to simplify the
design process for a preferred power amplifier stage by introducing
software-based routines in a programming language of their choice.
The book is in two parts, the first focusing on power amplifier
theory and the second on EDA concepts. Readers will gain enough
knowledge of RF and microwave transmission theory, principles of
active and passive device design and manufacturing, and power
amplifier design concepts to allow them to quickly create their own
programs, which will help to accelerate the transceiver design
process. All circuit designers facing the challenge of designing an
RF or microwave power amplifier for frequencies from 2 to 18 GHz
will find this book to be a valuable asset.
This book is the first standalone book that combines research into
low-noise amplifiers (LNAs) with research into millimeter-wave
circuits. In compiling this book, the authors have set two research
objectives. The first is to bring together the research context
behind millimeter-wave circuit operation and the theory of
low-noise amplification. The second is to present new research in
this multi-disciplinary field by dividing the common LNA
configurations and typical specifications into subsystems, which
are then optimized separately to suggest improvements in the
current state-of-the-art designs. To achieve the second research
objective, the state-of-the-art LNA configurations are discussed
and the weaknesses of state-of the art configurations are
considered, thus identifying research gaps. Such research gaps,
among others, point towards optimization - at a systems and
microelectronics level. Optimization topics include the influence
of short wavelength, layout and crosstalk on LNA performance.
Advanced fabrication technologies used to decrease the parasitics
of passive and active devices are also explored, together with
packaging technologies such as silicon-on-chip and
silicon-on-package, which are proposed as alternatives to
traditional IC implementation. This research outcome builds through
innovation. Innovative ideas for LNA construction are explored, and
alternative design methodologies are deployed, including
LNA/antenna co-design or utilization of the electronic design
automation in the research flow. The book also offers the authors'
proposal for streamlined automated LNA design flow, which focuses
on LNA as a collection of highly optimized subsystems.
This book provides a detailed review of power amplifiers, including
classes and topologies rarely covered in books, and supplies
sufficient information to allow the reader to design an entire
amplifier system, and not just the power amplification stage. A
central aim is to furnish readers with ideas on how to simplify the
design process for a preferred power amplifier stage by introducing
software-based routines in a programming language of their choice.
The book is in two parts, the first focusing on power amplifier
theory and the second on EDA concepts. Readers will gain enough
knowledge of RF and microwave transmission theory, principles of
active and passive device design and manufacturing, and power
amplifier design concepts to allow them to quickly create their own
programs, which will help to accelerate the transceiver design
process. All circuit designers facing the challenge of designing an
RF or microwave power amplifier for frequencies from 2 to 18 GHz
will find this book to be a valuable asset.
This book provides a system-level approach to making packaging
decisions for millimeter-wave transceivers. In electronics, the
packaging forms a bridge between the integrated circuit or
individual device and the rest of the electronic system,
encompassing all technologies between the two. To be able to make
well-founded packaging decisions, researchers need to understand a
broad range of aspects, including: concepts of transmission bands,
antennas and propagation, integrated and discrete package
substrates, materials and technologies, interconnects, passive and
active components, as well as the advantages and disadvantages of
various packages and packaging approaches, and package-level
modeling and simulation. Packaging also needs to be considered in
terms of system-level testing, as well as associated testing and
production costs, and reducing costs. This peer-reviewed work
contributes to the extant scholarly literature by addressing the
aforementioned concepts and applying them to the context of the
millimeter-wave regime and the unique opportunities that this
transmission approach offers.
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