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This book presents a systematic approach in performing reliability
assessment of solder joints using Finite Element (FE) simulation.
Essential requirements for FE modelling of an electronic package or
a single reflowed solder joint subjected to reliability test
conditions are elaborated. These cover assumptions considered for a
simplified physical model, FE model geometry development,
constitutive models for solder joints and aspects of FE model
validation. Fundamentals of the mechanics of solder material are
adequately reviewed in relation to FE formulations. Concept of
damage is introduced along with deliberation of cohesive zone model
and continuum damage model for simulation of solder/IMC interface
and bulk solder joint failure, respectively. Applications of the
deliberated methodology to selected problems in assessing
reliability of solder joints are demonstrated. These
industry-defined research-based problems include solder reflow
cooling, temperature cycling and mechanical fatigue of a BGA
package, JEDEC board-level drop test and mechanisms of solder joint
fatigue. Emphasis is placed on accurate quantitative assessment of
solder joint reliability through basic understanding of the
mechanics of materials as interpreted from results of FE
simulations. The FE simulation methodology is readily applicable to
numerous other problems in mechanics of materials and structures.
This book presents a systematic approach in performing reliability
assessment of solder joints using Finite Element (FE) simulation.
Essential requirements for FE modelling of an electronic package or
a single reflowed solder joint subjected to reliability test
conditions are elaborated. These cover assumptions considered for a
simplified physical model, FE model geometry development,
constitutive models for solder joints and aspects of FE model
validation. Fundamentals of the mechanics of solder material are
adequately reviewed in relation to FE formulations. Concept of
damage is introduced along with deliberation of cohesive zone model
and continuum damage model for simulation of solder/IMC interface
and bulk solder joint failure, respectively. Applications of the
deliberated methodology to selected problems in assessing
reliability of solder joints are demonstrated. These
industry-defined research-based problems include solder reflow
cooling, temperature cycling and mechanical fatigue of a BGA
package, JEDEC board-level drop test and mechanisms of solder joint
fatigue. Emphasis is placed on accurate quantitative assessment of
solder joint reliability through basic understanding of the
mechanics of materials as interpreted from results of FE
simulations. The FE simulation methodology is readily applicable to
numerous other problems in mechanics of materials and structures.
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