Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

Micromachined Ultrasound-Based Proximity Sensors presents a packaged ultrasound microsystem for object detection and distance metering based on micromachined silicon transducer elements. It describes the characterization, optimization and the long-term stability of silicon membrane resonators as well as appropriate packaging for ultrasound microsystems. Micromachined Ultrasound-Based Proximity Sensors describes a cost-effective approach to the realization of a micro electro mechanical system (MEMS). The micromachined silicon transducer elements were fabricated using industrial IC technology combined with standard silicon micromachining techniques. Additionally, this approach allows the cointegration of the driving and read-out circuitry. To ensure the industrial applicability of the fabricated transducer elements intensive long-term stability and reliability tests were performed under various environmental conditions such as high temperature and humidity. Great effort was undertaken to investigate the packaging and housing of the ultrasound system, which mainly determine the success or failure of an industrial microsystem. A low-stress mounting of the transducer element minimizes thermomechanical stress influences. The developed housing not only protects the silicon chip but also improves the acoustic performance of the transducer elements. The developed ultrasound proximity sensor system can determine object distances up to 10 cm with an accuracy of better than 0.8 mm. Micromachined Ultrasound-Based Proximity Sensors will be of interest to MEMS researchers as well as those involved in solid-state sensor development.

Based on the 'soft path' approach to the energy sector, a transition is now under way to a soft path for water. This approach starts by ensuring that ecosystem needs for water are satisfied and then undertakes a radical approach to reducing human uses of water by economic and social incentives, including open decision-making, water markets and equitable pricing, and the application of super-efficient technology, all applied in ways that avoid jeopardizing quality of life. The soft path for water is therefore a management strategy that frees up water by curbing water waste.

Making the Most of the Water We Have is the first to present and apply the water soft path approach. It has three aims:

• to bring to a wider audience the concept and the potential of water soft paths
• to demonstrate that soft path analysis is analytical and practical, and not just 'eco-dreaming'
• to indicate that soft paths are not only conceptually attractive but that they can be made economically and politically feasible.

Includes a tool kit for planners and other practitioners.

Published with POLIS Project and Friends of the Earth

Micromachined Ultrasound-Based Proximity Sensors presents a packaged ultrasound microsystem for object detection and distance metering based on micromachined silicon transducer elements. It describes the characterization, optimization and the long-term stability of silicon membrane resonators as well as appropriate packaging for ultrasound microsystems. Micromachined Ultrasound-Based Proximity Sensors describes a cost-effective approach to the realization of a micro electro mechanical system (MEMS). The micromachined silicon transducer elements were fabricated using industrial IC technology combined with standard silicon micromachining techniques. Additionally, this approach allows the cointegration of the driving and read-out circuitry. To ensure the industrial applicability of the fabricated transducer elements intensive long-term stability and reliability tests were performed under various environmental conditions such as high temperature and humidity. Great effort was undertaken to investigate the packaging and housing of the ultrasound system, which mainly determine the success or failure of an industrial microsystem. A low-stress mounting of the transducer element minimizes thermomechanical stress influences. The developed housing not only protects the silicon chip but also improves the acoustic performance of the transducer elements. The developed ultrasound proximity sensor system can determine object distances up to 10 cm with an accuracy of better than 0.8 mm. Micromachined Ultrasound-Based Proximity Sensors will be of interest to MEMS researchers as well as those involved in solid-state sensor development.

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

Based on the 'soft path' approach to the energy sector, a transition is now under way to a soft path for water. This approach starts by ensuring that ecosystem needs for water are satisfied and then undertakes a radical approach to reducing human uses of water by economic and social incentives, including open decision-making, water markets and equitable pricing, and the application of super-efficient technology, all applied in ways that avoid jeopardizing quality of life. The soft path for water is therefore a management strategy that frees up water by curbing water waste. Making the Most of the Water We Have is the first to present and apply the water soft path approach. It has three aims: to bring to a wider audience the concept and the potential of water soft paths to demonstrate that soft path analysis is analytical and practical, and not just 'eco-dreaming' to indicate that soft paths are not only conceptually attractive but that they can be made economically and politically feasible. Includes a tool kit for planners and other practitioners. Published with POLIS Project and Friends of the Earth