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Design and Crosstalk Analysis in Carbon Nanotube Interconnects (Hardcover, 1st ed. 2021): P. Uma Sathyakam, Partha Sharathi... Design and Crosstalk Analysis in Carbon Nanotube Interconnects (Hardcover, 1st ed. 2021)
P. Uma Sathyakam, Partha Sharathi Mallick
R3,268 Discovery Miles 32 680 Ships in 10 - 15 working days

This book provides a single-source reference on carbon nanotubes for interconnect applications. It presents the recent advances in modelling and challenges of carbon nanotube (CNT)-based VLSI interconnects. Starting with a background of carbon nanotubes and interconnects, this book details various aspects of CNT interconnect models, the design metrics of CNT interconnects, crosstalk analysis of recently proposed CNT interconnect structures, and geometries. Various topics covered include the use of semiconducting CNTs around metallic CNTs, CNT interconnects with air gaps, use of emerging ultra low-k materials and their integration with CNT interconnects, and geometry-based crosstalk reduction techniques. This book will be useful for researchers and design engineers working on carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Sensors for Next-Generation Electronic Systems and Technologies (Hardcover): K. Venkata Lakshmi Narayana, P. Uma Sathyakam Sensors for Next-Generation Electronic Systems and Technologies (Hardcover)
K. Venkata Lakshmi Narayana, P. Uma Sathyakam
R3,406 Discovery Miles 34 060 Ships in 12 - 17 working days

The text covers fiber optic sensors for biosensing and photo-detection, graphene and CNT-based sensors for glucose, cholesterol, and dopamine detection, and implantable sensors for detecting physiological, bio-electrical, biochemical, and metabolic changes in a comprehensive manner. It further presents a chapter on sensors for military and aerospace applications. It will be useful for senior undergraduate, graduate students, academic researchers in the fields of electrical engineering, electronics, and communication engineering. The book Discusses implantable sensors for detecting physiological, bio-electrical, biochemical, and metabolic changes. Covers applications of sensors in diverse fields including healthcare, industrial flow, consumer electronics, and military. Includes experimental studies such as the detection of biomolecules using SPR sensors and electrochemical sensors for biomolecule detection. Presents artificial neural networks (ANN) based industrial flow sensor modeling. Highlights case studies on surface plasmon resonance sensors, MEMS-based fluidic sensors, and MEMS-based electrochemical gas sensors. The text presents case studies on surface plasmon resonance sensors, MEMS-based fluidic sensors, and MEMS-based electrochemical gas sensors in a single volume. The text will be useful for senior undergraduate, graduate students, academic researchers in the fields of electrical engineering, electronics, and communication engineering.

Design and Crosstalk Analysis in Carbon Nanotube Interconnects (Paperback, 1st ed. 2021): P. Uma Sathyakam, Partha Sharathi... Design and Crosstalk Analysis in Carbon Nanotube Interconnects (Paperback, 1st ed. 2021)
P. Uma Sathyakam, Partha Sharathi Mallick
R3,226 Discovery Miles 32 260 Ships in 10 - 15 working days

This book provides a single-source reference on carbon nanotubes for interconnect applications. It presents the recent advances in modelling and challenges of carbon nanotube (CNT)-based VLSI interconnects. Starting with a background of carbon nanotubes and interconnects, this book details various aspects of CNT interconnect models, the design metrics of CNT interconnects, crosstalk analysis of recently proposed CNT interconnect structures, and geometries. Various topics covered include the use of semiconducting CNTs around metallic CNTs, CNT interconnects with air gaps, use of emerging ultra low-k materials and their integration with CNT interconnects, and geometry-based crosstalk reduction techniques. This book will be useful for researchers and design engineers working on carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

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