The book Handheld Total Chemical and Biological Analysis Systems: Bridging NMR, Digital Microfluidics, and Semiconductors centers on the complete design of Nuclear Magnetic Resonance (NMR) microsystems for in vitro chemical and biological assays based on semiconductor chips and portable magnet. Different sensing mechanisms for CMOS in vitro assay are compared, key design criteria of the CMOS transceiver for NMR measurement are revealed, and system-level optimizations of the CMOS NMR platform utilizing digital microfluidic and diverse functions of the CMOS technology are discussed. Two CMOS NMR platforms are implemented, each of these focuses on different aspect of optimization.

This book presents high-/mixed-voltage analog and radio frequency (RF) circuit techniques for developing low-cost multistandard wireless receivers in nm-length CMOS processes. Key benefits of high-/mixed-voltage RF and analog CMOS circuits are explained, state-of-the-art examples are studied, and circuit solutions before and after voltage-conscious design are compared. Three real design examples are included, which demonstrate the feasibility of high-/mixed-voltage circuit techniques. Provides a valuable summary and real case studies of the state-of-the-art in high-/mixed-voltage circuits and systems; Includes novel high-/mixed-voltage analog and RF circuit techniques - from concept to practice; Describes the first high-voltage-enabled mobile-TVRF front-end in 90nm CMOS and the first mixed-voltage full-band mobile-TV Receiver in 65nm CMOS;Demonstrates the feasibility of high-/mixed-voltage circuit techniques with real design examples."

This book provides readers with a state-of-the-art description of techniques to be used for ultra-low-power (ULP) and ultra-low-cost (ULC), short-range wireless receivers. Readers will learn what is required to deploy these receivers in short-range wireless sensor networks, which are proliferating widely to serve the internet of things (IoT) for "smart cities." The authors address key challenges involved with the technology and the typical tradeoffs between ULP and ULC. Three design examples with advanced circuit techniques are described in order to address these trade-offs, which special focus on cost minimization. These three techniques enable respectively, cascading of radio frequency (RF) and baseband (BB) circuits under an ultra-low-voltage (ULV) supply, cascading of RF and BB circuits in current domain for current reuse and a novel function-reuse receiver architecture, suitable for ULV and multi-band ULP applications such as the sub-GHz ZigBee.

This book provides readers with a single-source reference to the state-of-the-art in analog and mixed-signal circuit design in nanoscale CMOS. Renowned authors from academia describe creative circuit solutions and techniques, in state-of-the-art designs, enabling readers to deal with today's technology demands for high integration levels with a strong miniaturization capability.

This volume reviews the fundamentals and studies the state-of-the-art multistandard transceivers before describing novel architectural and circuit techniques for implementing multimode and wideband (tens of MHz) baseband analog front-ends under low-voltage constraints. Techniques developed on architecture level for efficient system-in-package (SiP) integration, testability and multi-standardability; and on circuit level for reducing the required supply voltage, power and area, are generally applicable for most wireless systems, and are somewhat independent to technology scaling. Experimental 1-V baseband building blocks and a 1-V fully-integrated receiver analog-baseband chain for IEEE 802.11a/b/g WLAN validate the techniques. The implementations are all in standard-VTH CMOS process, and no voltage boosting is required at any node.

This book provides readers with a state-of-the-art description of techniques to be used for ultra-low-power (ULP) and ultra-low-cost (ULC), short-range wireless receivers. Readers will learn what is required to deploy these receivers in short-range wireless sensor networks, which are proliferating widely to serve the internet of things (IoT) for "smart cities." The authors address key challenges involved with the technology and the typical tradeoffs between ULP and ULC. Three design examples with advanced circuit techniques are described in order to address these trade-offs, which special focus on cost minimization. These three techniques enable respectively, cascading of radio frequency (RF) and baseband (BB) circuits under an ultra-low-voltage (ULV) supply, cascading of RF and BB circuits in current domain for current reuse and a novel function-reuse receiver architecture, suitable for ULV and multi-band ULP applications such as the sub-GHz ZigBee.

This book presents high-/mixed-voltage analog and radio frequency (RF) circuit techniques for developing low-cost multistandard wireless receivers in nm-length CMOS processes. Key benefits of high-/mixed-voltage RF and analog CMOS circuits are explained, state-of-the-art examples are studied, and circuit solutions before and after voltage-conscious design are compared. Three real design examples are included, which demonstrate the feasibility of high-/mixed-voltage circuit techniques. Provides a valuable summary and real case studies of the state-of-the-art in high-/mixed-voltage circuits and systems; Includes novel high-/mixed-voltage analog and RF circuit techniques - from concept to practice; Describes the first high-voltage-enabled mobile-TVRF front-end in 90nm CMOS and the first mixed-voltage full-band mobile-TV Receiver in 65nm CMOS;Demonstrates the feasibility of high-/mixed-voltage circuit techniques with real design examples."

This book presents architectural and circuit techniques for wireless transceivers to achieve multistandard and low-voltage compliance. It provides an up-to-date survey and detailed study of the state-of-the-art transceivers for modern single- and multi-purpose wireless communication systems. The book includes comprehensive analysis and design of multimode reconfigurable receivers and transmitters for an efficient multistandard compliance.

Technology-assisted People-to-People (P2P) interactions, embedded in a global environment, will be at the core of 21st century communications and will command the technological development of the forthcoming future. The intelligent interactivity of people, process (delivering the right information to the right person/machine at the right time), data and things, incorporates the Internet-of-Everything (IoE) that expands itself beyond the Internet-of-Things (IoT). In general, IoT comprises all physical or cyber objects (things) with an address that can transmit data (without human-to-machine interactions), while the IoE also involves communications among the users and the whole universe of electronic gadgets. Further, they both operate with data acquired from analog sources, thus connecting two different realities, the analog (physical/real) and the digital (cyber/virtual) worlds. Since the interface between the two realms deals with analog signals, its mandatory functions integrate several analog and mixed-signal sub-systems that include signal sensing, transmission and reception, frequency generation, energy harvesting, in-memory processing, data and power conversion. This publication presents state-of-the-art designs of the most critical building blocks of the analog/digital interface highlighting new and innovative circuit architectures and techniques. It addresses capacitive sensor interfaces, ultra-low-power wireless transceivers, key technologies for wireline transceivers, oscillators and frequency generators, integrated energy harvesting interfaces, in-memory processing, as well as, data and power converters, all exhibiting high quality performance with low power consumption, high energy-efficiency and high speed, thus enabling a reliable and consistent development of the IoE while enlarging its frontiers. In the coming decades, with the continuous evolution of electronics downscaling, the challenges that the above-mentioned sub-systems face will be tremendous in terms of the requirements for ultra-low power and ultra-high speed, obtained with the maximum energy-efficiency. Thus, the analog and mixed-signal very large scale integration area of work will continue to be an attractive field for research for design engineers both in the academia and in the industry, as it has been always the case since the emergence of silicon planar electronics 6 decades ago.