The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.

This important new book contains the latest information on an important area of business, including both management and technological developments. Materials management has developed into one of the most important aspects of the modern business and is considered as a major source of competitive advantage. With lower stock levels than in the past, businesses must ensure that what inventory they do hold is handled and distributed as efficiently and cost effectively as possible. Stores and Distribution Management brings together all of the latest theory and practice. The book has been specifically designed to cover the latest syllabuses for the Chartered Institute of Purchasing and Supply Professional Level courses in Stores Management and Inventory Control, and the Distribution option.