The papers published in these proceedings represent the latest developments in the nondestructive characterization of materials and were presented at the Eleventh International Symposium on Nondestructive Characterization of Materials held in June 24-28, 2002, in Berlin, Germany.

There is a great deal of interest in extending nondestructive technologies beyond the location and identification of cracks and voids. Specifically there is growing interest in the application of nondestructive evaluation (NOEl to the measurement of physical and mechanical properties of materials. The measurement of materials properties is often referred to as materials characterization; thus nondestructive techniques applied to characterization become nondestructive characterization (NDCl. There are a number of meetings, proceedings and journals focused upon nondestructive technologies and the detection and identification of cracks and voids. However, the series of symposia, of which these proceedings represent the fourth, are the only meetings uniquely focused upon nondestructive characterization. Moreover, these symposia are especially concerned with stimulating communication between the materials, mechanical and manufacturing engineer and the NDE technology oriented engineer and scientist. These symposia recognize that it is the welding of these areas of expertise that is necessary for practical development and application of NDC technology to measurements of components for in service life time and sensor technology for intelligent processing of materials. These proceedings are from the fourth international symposia and are edited by c.o. Ruud, J. F. Bussiere and R.E. Green, Jr. . The dates, places, etc of the symposia held to date area as follows: Symposia on Nondestructive Methods for TITLE: Material Property Determination DATES: April 6-8, 1983 PLACE: Hershey, PA, USA CHAIRPERSONS: C.O. Ruud and R.E. Green, Jr."

This work examines a rich tapestry of themes and concepts and provides a comprehensive treatment of an important area of mathematics, while simultaneously covering a broader area of the geometry of domains in complex space. At once authoritative and accessible, this text touches upon many important parts of modern mathematics: complex geometry, equivalent embeddings, Bergman and Kahler geometry, curvatures, differential invariants, boundary asymptotics of geometries, group actions, and moduli spaces.

"The Geometry of Complex Domains" can serve as a coming of age book for a graduate student who has completed at least one semester or more of complex analysis, and will be most welcomed by analysts and geometers engaged in current research.

The papers published in these proceedings represent the latest developments in the nondestructive characterization of materials and were presented at the Eleventh International Symposium on Nondestructive Characterization of Materials held in June 2002, in Berlin, Germany.

There is a great deal of interest in extending nondestructive technologies beyond the location and identification of cracks and voids. Specifically there is growing interest in the application of nondestructive evaluation (NOEl to the measurement of physical and mechanical properties of materials. The measurement of materials properties is often referred to as materials characterization; thus nondestructive techniques applied to characterization become nondestructive characterization (NDCl. There are a number of meetings, proceedings and journals focused upon nondestructive technologies and the detection and identification of cracks and voids. However, the series of symposia, of which these proceedings represent the fourth, are the only meetings uniquely focused upon nondestructive characterization. Moreover, these symposia are especially concerned with stimulating communication between the materials, mechanical and manufacturing engineer and the NDE technology oriented engineer and scientist. These symposia recognize that it is the welding of these areas of expertise that is necessary for practical development and application of NDC technology to measurements of components for in service life time and sensor technology for intelligent processing of materials. These proceedings are from the fourth international symposia and are edited by c.o. Ruud, J. F. Bussiere and R.E. Green, Jr. . The dates, places, etc of the symposia held to date area as follows: Symposia on Nondestructive Methods for TITLE: Material Property Determination DATES: April 6-8, 1983 PLACE: Hershey, PA, USA CHAIRPERSONS: C.O. Ruud and R.E. Green, Jr."

The possibility of nondestructively characterizing the microstruc ture, morphology or mechanical properties of materials is certainly a fascinating subject. In principle, such techniques can be used at all stages of a material's life - from the early stages of processing, to the end of a structural component's useful life. Interest in the subject thus arises not only from a purely scientific point of view but is also strongly motivated by economic pressures to improve productivity and quality in manufacturing, to insure the reliability and extend the life of existing structures. The present volume represents the edited papers presented at the Second International Symposium on the Nondestructive Characterization of Materials, held in Montreal, Canada, July 21-23, 1986. The Proceedings are divided into eight sections, which reflect the multidisciplinary nature of characterizing materials nondestructively: Polymers and Composites, Ceramics and Powder Metallurgy, Metals, Layered Structures/Adhesive Bonds/Welding, Degradation/Aging, Texture/ Anisotropy, Stress, and New Techniques. Invited papers by R. Hadcock of Grumman Aircraft Systems, R. Cannon of Rutgers University, H. Yada of Nippon Steel and R. Bridenbaugh of Alcoa review respectively the processing of polymer matrix composites, ceramics, steel and aluminum, emphasizing the need for material property sensors to improve process and quality control. Two other invited papers, one by A. Wedgwood of Harwell and the other by P. Holler of the IzFP in Saarbrucken review state of the art techniques to characterize particulate matter and metals respectively.

Engineering structures for reliable function and safety have to be designed such that operational mechanical loads are compensated for by stresses in the components bearable by the materials used. Vhat is "bearable"? First of all it depends on the properties of the chosen materials as well as on several other parameters, e.g. temperature, corrosivity of the environment, elapsed or remaining serviceable life, unexpected deterioration of materials, whatever the source and nature of such deterioration may be: defects, loss of strength, embrittlement, wastage, etc. DEFECTS and PROPERTIES of materials currently determine loadability. Therefore in addition to nondestructive testing for defects there is also a need for nondestructive testing of properties. The third type of information to be supplied by nondestructive measurement pertains to STRESS STATES under OPERATIONAL LOADS, i.e. LOAD-INDUCED plus RESIDUAL STRESSES. Residual stresses normally cannot be calculated; they have to be measured nondestructively; well-approved elastomechanical finite element codes are available and used for calculating load-induced stresses; for redundancy and reliability, engineers, however, need procedures and instrumentation for experimental checks.

Additional Editor Is W. Eugene Stern. Contributors Include William J. Atkinson, Kenneth M. Browne, John V. Crawford And Many Others.

Additional Editor Is W. Eugene Stern. Contributors Include William J. Atkinson, Kenneth M. Browne, John V. Crawford And Many Others.

A fresh approach to introductory topology, this volume explains nontrivial applications of metric space topology to analysis, clearly establishing their relationship. Also, topics from elementary algebraic topology focus on concrete results with minimal algebraic formalism. The first two chapters consider metric space and point-set topology; the second two, algebraic topological material. 1983 ed. Solutions to Selected Exercises. List of Notations. Index. 51 illus.