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The scope of this book is to identify and emphasize the successful link between computational materials modeling as a simulation and design tool and its synergistic application to experimental research and alloy development. The book provides a more balanced perspective of the role that computational modeling can play in every day research and development efforts. Each chapter describes one or more particular computational tool and how they are best used.
High-temperature structural intermetallics continue to be an active field of research because they offer the promise of structural properties, oxidation resistance and service temperatures exceeding those of conventional metals and alloys. However, they also present problems with respect to their understanding and processing. Current research into aluminide- and silicide-based materials illustrates this point very well. Continuing advances require basic studies to support alloy development as well as the identification and exploration of applications. This book, first published in 2001, provides a representative cross-section of research carried out and should be of interest to a wide range of readers. The most 'popular' material continues to be TiAl, which is beginning to find applications as a light-weight, high-strength, oxidation resistant structural material. There is renewed interest in structural silicides with melting points on the order of 2000%C. Examples include intermetallics with thermoelectric properties as well as intermetallics with shape memory effects at unusually high temperatures above 1000 DegreesC.
The scope of this book is to identify and emphasize the successful link between computational materials modeling as a simulation and design tool and its synergistic application to experimental research and alloy development. The book provides a more balanced perspective of the role that computational modeling can play in every day research and development efforts. Each chapter describes one or more particular computational tool and how they are best used.
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