As the trend toward the increased miniaturization of devices continues, solder interconnects are becoming the limiting factor in the reliability of electronic packages. With the critical nature of these small electrical-mechanical interconnections, the question arises: Just how reliable are the solder joints in a modern electronic package? The authors will answer this question by addressing the materials and mechanics issues associated with solder joints in this state-of-the-art assessment. The reader will learn the basic metallurgy of solder alloys, the constitutive models available for modeling solder interconnects, computational simulations to predict solder joint geometry, and the application of mechanics models to through-hole and surface mount technologies. The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a "stand-alone" resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.