Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. The Handbook of Lapping and Polishing is the first source in English to bring to the light of day the physical fundamentals and advanced technologies at the leading edge of modern lapping and polishing practice. Collecting decisive work contributed by industrial and academic experts from the USA, Germany, and Japan, this authoritative resource presents the latest lapping and polishing technologies along with case studies that illustrate their value. After a brief introduction, the book explains the fundamental concepts and major types of lapping and polishing processes. The discussion then turns to lapping of ductile and brittle materials followed by an in-depth look at lapping machines and equipment. Rounding out the presentation, the final chapters discuss polishing technologies and equipment as well as the latest on chemical-mechanical polishing (CMP) and its applications in the semiconductor industry. Offering an integrated approach to both theory and practical applications under a single cover, the Handbook of Lapping and Polishing supplies a definitive survey of the most advanced surface finishing technologies available.

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field making cutting-edge R&D accessible to the wider engineering community.

Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience.

Building on the fundamentals of tribology the science of friction, wear and lubrication the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.

Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering

Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments

The authors bring together the latest innovations and research from the USA and Japan"

Handbook of Ceramics Grinding and Polishing meets the growing need in manufacturing industries for a clear understanding of the latest techniques in ceramics processing. The properties of ceramics make them very useful as components-they withstand high temperatures and are durable, resistant to wear, chemical degradation, and light. In recent years the use of ceramics has been expanding, with applications in most industry sectors that use machined parts, especially where corrosion-resistance is required, and in high temperature environments. However, they are challenging to produce and their use in high-precision manufacturing often requires adjustments to be made at the micro and nano scale. This book helps ceramics component producers to do cost-effective, highly precise machining. It provides a thorough grounding in the fundamentals of ceramics-their properties and characteristics-and of the abrasive processes used to manipulate their final shape as well as the test procedures vital for success. The second edition has been updated throughout, with the latest developments in technologies, techniques, and materials. The practical nature of the book has also been enhanced; numerous case studies illustrating how manufacturing (machining) problems have been handled are complemented by a highly practical new chapter on the selection and efficient use of machine tools.