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Photonic Packaging Sourcebook - Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules (Hardcover, 2013):... Photonic Packaging Sourcebook - Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules (Hardcover, 2013)
Ulrich H. P. Fischer-Hirchert
R4,820 Discovery Miles 48 200 Ships in 12 - 17 working days

This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.

Photonic Packaging Sourcebook - Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules (Paperback, Softcover... Photonic Packaging Sourcebook - Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules (Paperback, Softcover reprint of the original 1st ed. 2015)
Ulrich H. P. Fischer-Hirchert
R3,320 Discovery Miles 33 200 Ships in 10 - 15 working days

This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.

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