Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI systems, and wafer scale integrated circuits. In 1987, Dr. W. Moore organized an "International Workshop on Designing for Yield" at Oxford University. Edited papers of that workshop were published in reference [II. The participants in that workshop agreed that meetings of this type should he con tinued. preferahly on a yearly hasis. It was Dr. I. Koren who organized the "IEEE Inter national Workshop on Defect and Fault Tolerance in VLSI Systems" in Springfield Massachusetts the next year. Selected papers from that workshop were puhlished as the first volume of this series [21.

Increased demand for and developments in micromanufacturing have created a need for a resource that covers both the science and technology of this rapidly growing area. With contributions from eminent professors and researchers actively engaged in teaching, research, and development, Micromanufacturing Processes details the basic principles, tools, techniques, and latest advances in micromanufacturing processes. It includes coverage of measurement techniques and research trends as well as a large number of cross-references, making it useful to the students and researchers alike. The book outlines the challenges faced not only in micromanufacturing but also in meso- and nanomanufacturing, exploring topics such as micromachining, micro welding, microforming, micromolding, nanofinishing and micro-/nano-metrology. It includes examples that demonstrate the capabilities of fabricating micro- / nano-products and micro- / nano-features on the macro and micro products. The text also discusses nanofinishing techniques giving surface finish in the domain of sub-nano level, micro welding techniques, namely, laser beam micro welding, electron beam micro welding, micro / nano patterning in large quantities, and micro / nano metrology principles and equipments. It goes on to describe devices such as nano spring, micro mixer, micro cantilever, to name just a few. Unique in its level of coverage, the book highlights new challenges in manufacturing and covers several different types of micromanufacturing processes, such as micromachining, microforming, microcasting, microjoining, nanofinishing, and micrometrology. The level of details, extensive references, figures, and diagrams make the book a reference that will become the standard for this field.

Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI systems, and wafer scale integrated circuits. In 1987, Dr. W. Moore organized an "International Workshop on Designing for Yield" at Oxford University. Edited papers of that workshop were published in reference [II. The participants in that workshop agreed that meetings of this type should he con tinued. preferahly on a yearly hasis. It was Dr. I. Koren who organized the "IEEE Inter national Workshop on Defect and Fault Tolerance in VLSI Systems" in Springfield Massachusetts the next year. Selected papers from that workshop were puhlished as the first volume of this series [21.

In the era of nanotechnology, deterministic high precision finishing methods with automated finishing without manual intervention are of utmost importance and are the need of the present manufacturing scenario. Also, finishing of high precision parts having complex geometrical shapes is most critical and labor intensive. Rotational-Magnetorheological Abrasive Flow Finishing (R-MRAFF) offers both automation and flexibility in final finishing operations. The book is organized into six chapters. Chapter 1 introduces briefly the state-of-art of the precision finishing processes and mechanism of R-MRAFF process. Chapter 2 discusses development of R-MRAFF experimental setup. Study of the rheological behavior of MR polishing fluid is discussed in Chapter 3. Chapter 4 reports the findings related to the finishing experiments conducted on flat brass, EN-steel, and SS workpieces. In Chapter 5, experimental results related to finishing of internal surfaces and corrections of roundness error of SS tubes have been discussed. In Chapter 6, Computational Fluid Dynamics (CFD) simulation and magnetic field simulation of MRAFF process are explained.

Fresh excavations, new dating techniques and ever-growing conceptual frame-works since 1950 have greatly reshaped our perspective on Prehistory and Protohistory of the Indian subcontinent. This monograph, which is primarily aimed to serve as a starter for the undergraduate and postgraduate students, presents, in a concise but comprehensive manner, a syncretic view of the latest information on various aspects such as tools and technologies, settlement and subsistence patterns, ecological background and distributional configuration in respect of the Stone Age and the Chalcolithic Cultures outside the Harappan Zone. The Megalithic Cultures of peninsular India and the Deccan too find a place in the book. A glossary of the terms used frequently in archaeology as well as maps, line-drawings and explanatory notes on individual sites add further value to the text.

Increased demand for and developments in micromanufacturing have created a need for a resource that covers both the science and technology of this rapidly growing area. With contributions from eminent professors and researchers actively engaged in teaching, research, and development, Micromanufacturing Processes details the basic principles, tools, techniques, and latest advances in micromanufacturing processes. It includes coverage of measurement techniques and research trends as well as a large number of cross-references, making it useful to the students and researchers alike.

The book outlines the challenges faced not only in micromanufacturing but also in meso- and nanomanufacturing, exploring topics such as micromachining, micro welding, microforming, micromolding, nanofinishing and micro-/nano-metrology. It includes examples that demonstrate the capabilities of fabricating micro- / nano-products and micro- / nano-features on the macro and micro products. The text also discusses nanofinishing techniques giving surface finish in the domain of sub-nano level, micro welding techniques, namely, laser beam micro welding, electron beam micro welding, micro / nano patterning in large quantities, and micro / nano metrology principles and equipments. It goes on to describe devices such as nano spring, micro mixer, micro cantilever, to name just a few.

Unique in its level of coverage, the book highlights new challenges in manufacturing and covers several different types of micromanufacturing processes, such as micromachining, microforming, microcasting, microjoining, nanofinishing, and micrometrology. The level of details, extensive references, figures, and diagrams make the book a reference that will become the standard for this field.