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Increased demand for and developments in micromanufacturing have
created a need for a resource that covers both the science and
technology of this rapidly growing area. With contributions from
eminent professors and researchers actively engaged in teaching,
research, and development, Micromanufacturing Processes details the
basic principles, tools, techniques, and latest advances in
micromanufacturing processes. It includes coverage of measurement
techniques and research trends as well as a large number of
cross-references, making it useful to the students and researchers
alike. The book outlines the challenges faced not only in
micromanufacturing but also in meso- and nanomanufacturing,
exploring topics such as micromachining, micro welding,
microforming, micromolding, nanofinishing and
micro-/nano-metrology. It includes examples that demonstrate the
capabilities of fabricating micro- / nano-products and micro- /
nano-features on the macro and micro products. The text also
discusses nanofinishing techniques giving surface finish in the
domain of sub-nano level, micro welding techniques, namely, laser
beam micro welding, electron beam micro welding, micro / nano
patterning in large quantities, and micro / nano metrology
principles and equipments. It goes on to describe devices such as
nano spring, micro mixer, micro cantilever, to name just a few.
Unique in its level of coverage, the book highlights new challenges
in manufacturing and covers several different types of
micromanufacturing processes, such as micromachining, microforming,
microcasting, microjoining, nanofinishing, and micrometrology. The
level of details, extensive references, figures, and diagrams make
the book a reference that will become the standard for this field.
Higher circuit densities, increasingly more complex application
ohjectives, and advanced packaging technologies have suhstantially
increased the need to incorporate defect-tolerance and
fault-tolerance in the design of VLSI and WSI systems. The goals of
defect-tolerance and fault-tolerance are yield enhancement and
improved reliahility. The emphasis on this area has resulted in a
new field of interdisciplinary scientific research. I n fact,
advanced methods of defect/fault control and tolerance are
resulting in enhanced manufacturahility and productivity of
integrated circuit chips, VI.SI systems, and wafer scale integrated
circuits. In 1987, Dr. W. Moore organized an "International
Workshop on Designing for Yield" at Oxford University. Edited
papers of that workshop were published in reference [II. The
participants in that workshop agreed that meetings of this type
should he con tinued. preferahly on a yearly hasis. It was Dr. I.
Koren who organized the "IEEE Inter national Workshop on Defect and
Fault Tolerance in VLSI Systems" in Springfield Massachusetts the
next year. Selected papers from that workshop were puhlished as the
first volume of this series [21.
Higher circuit densities, increasingly more complex application
ohjectives, and advanced packaging technologies have suhstantially
increased the need to incorporate defect-tolerance and
fault-tolerance in the design of VLSI and WSI systems. The goals of
defect-tolerance and fault-tolerance are yield enhancement and
improved reliahility. The emphasis on this area has resulted in a
new field of interdisciplinary scientific research. I n fact,
advanced methods of defect/fault control and tolerance are
resulting in enhanced manufacturahility and productivity of
integrated circuit chips, VI.SI systems, and wafer scale integrated
circuits. In 1987, Dr. W. Moore organized an "International
Workshop on Designing for Yield" at Oxford University. Edited
papers of that workshop were published in reference [II. The
participants in that workshop agreed that meetings of this type
should he con tinued. preferahly on a yearly hasis. It was Dr. I.
Koren who organized the "IEEE Inter national Workshop on Defect and
Fault Tolerance in VLSI Systems" in Springfield Massachusetts the
next year. Selected papers from that workshop were puhlished as the
first volume of this series [21.
In the era of nanotechnology, deterministic high precision
finishing methods with automated finishing without manual
intervention are of utmost importance and are the need of the
present manufacturing scenario. Also, finishing of high precision
parts having complex geometrical shapes is most critical and labor
intensive. Rotational-Magnetorheological Abrasive Flow Finishing
(R-MRAFF) offers both automation and flexibility in final finishing
operations. The book is organized into six chapters. Chapter 1
introduces briefly the state-of-art of the precision finishing
processes and mechanism of R-MRAFF process. Chapter 2 discusses
development of R-MRAFF experimental setup. Study of the rheological
behavior of MR polishing fluid is discussed in Chapter 3. Chapter 4
reports the findings related to the finishing experiments conducted
on flat brass, EN-steel, and SS workpieces. In Chapter 5,
experimental results related to finishing of internal surfaces and
corrections of roundness error of SS tubes have been discussed. In
Chapter 6, Computational Fluid Dynamics (CFD) simulation and
magnetic field simulation of MRAFF process are explained.
Fresh excavations, new dating techniques and ever-growing
conceptual frame-works since 1950 have greatly reshaped our
perspective on Prehistory and Protohistory of the Indian
subcontinent. This monograph, which is primarily aimed to serve as
a starter for the undergraduate and postgraduate students,
presents, in a concise but comprehensive manner, a syncretic view
of the latest information on various aspects such as tools and
technologies, settlement and subsistence patterns, ecological
background and distributional configuration in respect of the Stone
Age and the Chalcolithic Cultures outside the Harappan Zone. The
Megalithic Cultures of peninsular India and the Deccan too find a
place in the book. A glossary of the terms used frequently in
archaeology as well as maps, line-drawings and explanatory notes on
individual sites add further value to the text.
LASER SYSTEMS AND APPLICATIONS provides the foundation for
understanding the subject of lasers. The topics included in this
book are various experiments that led to the foundation of quantum
mechanics, concepts of atomic and molecular spectra. Basic concepts
of lasers, solid, liquid and gas lasers, Q-switching and mode
locking are described. The applications of laser to material
processing, medicine and surgery, holography, optical
communication, Lidar, military, meteorology, isotope separation,
nuclear fusion are discussed.
Increased demand for and developments in micromanufacturing have
created a need for a resource that covers both the science and
technology of this rapidly growing area. With contributions from
eminent professors and researchers actively engaged in teaching,
research, and development, Micromanufacturing Processes details the
basic principles, tools, techniques, and latest advances in
micromanufacturing processes. It includes coverage of measurement
techniques and research trends as well as a large number of
cross-references, making it useful to the students and researchers
alike.
The book outlines the challenges faced not only in
micromanufacturing but also in meso- and nanomanufacturing,
exploring topics such as micromachining, micro welding,
microforming, micromolding, nanofinishing and
micro-/nano-metrology. It includes examples that demonstrate the
capabilities of fabricating micro- / nano-products and micro- /
nano-features on the macro and micro products. The text also
discusses nanofinishing techniques giving surface finish in the
domain of sub-nano level, micro welding techniques, namely, laser
beam micro welding, electron beam micro welding, micro / nano
patterning in large quantities, and micro / nano metrology
principles and equipments. It goes on to describe devices such as
nano spring, micro mixer, micro cantilever, to name just a few.
Unique in its level of coverage, the book highlights new
challenges in manufacturing and covers several different types of
micromanufacturing processes, such as micromachining, microforming,
microcasting, microjoining, nanofinishing, and micrometrology. The
level of details, extensive references, figures, and diagrams make
the book a reference that will become the standard for this
field.
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