Recent advancements in carbon and molecular electronics have opened the door to a new generation of electronic nanoscale components. This book outlines the basic principles of electromagnetic-based communication at this nanoscale using terahertz and optical frequencies with a focus on theoretical principles and applications. It answers the questions: How can nano-devices communicate with each other by applying electromagnetic techniques? Do conventional communication and networking schemes and principles still apply? How feasible is it to deploy such networks with various applications? Topics covered include an introduction to nano-communication; fundamentals and applications of nano-electromagnetic communications; simulation and experimental platforms for nano-electromagnetic communication networks; terahertz antenna design for wearable applications; terahertz application in food contamination detection; channel modelling for electromagnetic nano-communication; modulation, coding and synchronization techniques for nano-electromagnetic communications in the terahertz band; routing protocols for nano-electromagnetic communication networks; error control mechanisms for nano-electromagnetic communication networks; and conclusion and future outlook.

With the increasing scalability of semiconductor processes, the higher level of functional integration at the die level, and the system integration of different technologies needed for consumer electronics, System-in-Package (SiP) is the new advanced system integration technology, which integrates (or vertically stacks) within a single package multiple components such as CPU, digital logic, analog/mixed-signal, memory, and passive and discrete components in a single system. System-in-Package: Electrical and Layout Perspectives focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of SiP. It first introduces package technologies, and then presents SiP design flow and design exploration. Finally, the paper discusses details of beyond-die signal and power integrity and physical implementation such as I/O (input/output cell) placement and routing for redistribution layer, escape, and substrate. System-in-Package: Electrical and Layout Perspectives is an invaluable reference for EDA researchers, professionals, and graduate students.