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Recent advancements in carbon and molecular electronics have opened
the door to a new generation of electronic nanoscale components.
This book outlines the basic principles of electromagnetic-based
communication at this nanoscale using terahertz and optical
frequencies with a focus on theoretical principles and
applications. It answers the questions: How can nano-devices
communicate with each other by applying electromagnetic techniques?
Do conventional communication and networking schemes and principles
still apply? How feasible is it to deploy such networks with
various applications? Topics covered include an introduction to
nano-communication; fundamentals and applications of
nano-electromagnetic communications; simulation and experimental
platforms for nano-electromagnetic communication networks;
terahertz antenna design for wearable applications; terahertz
application in food contamination detection; channel modelling for
electromagnetic nano-communication; modulation, coding and
synchronization techniques for nano-electromagnetic communications
in the terahertz band; routing protocols for nano-electromagnetic
communication networks; error control mechanisms for
nano-electromagnetic communication networks; and conclusion and
future outlook.
With the increasing scalability of semiconductor processes, the
higher level of functional integration at the die level, and the
system integration of different technologies needed for consumer
electronics, System-in-Package (SiP) is the new advanced system
integration technology, which integrates (or vertically stacks)
within a single package multiple components such as CPU, digital
logic, analog/mixed-signal, memory, and passive and discrete
components in a single system. System-in-Package: Electrical and
Layout Perspectives focuses on electrical and layout perspectives,
as opposed to discussing thermal and mechanic characteristics of
SiP. It first introduces package technologies, and then presents
SiP design flow and design exploration. Finally, the paper
discusses details of beyond-die signal and power integrity and
physical implementation such as I/O (input/output cell) placement
and routing for redistribution layer, escape, and substrate.
System-in-Package: Electrical and Layout Perspectives is an
invaluable reference for EDA researchers, professionals, and
graduate students.
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