This book constitutes the refereed proceedings of the workshop held in conjunction with the 28th International Conference on Artificial Intelligence, IJCAI 2019, held in Macao, China, in August 2019: the First International Workshop on Human Brain and Artificial Intelligence, HBAI 2019. The 24 full papers presented were carefully reviewed and selected from 62 submissions. The papers are organized according to the following topical headings: computational brain science and its applications; brain-inspired artificial intelligence and its applications.

This book constitutes the refereed joint proceedings of the 4th International Workshop on Large-Scale Annotation of Biomedical Data and Expert Label Synthesis, LABELS 2019, the First International Workshop on Hardware Aware Learning for Medical Imaging and Computer Assisted Intervention, HAL-MICCAI 2019, and the Second International Workshop on Correction of Brainshift with Intra-Operative Ultrasound, CuRIOUS 2019, held in conjunction with the 22nd International Conference on Medical Imaging and Computer-Assisted Intervention, MICCAI 2019, in Shenzhen, China, in October 2019. The 8 papers presented at LABELS 2019, the 5 papers presented at HAL-MICCAI 2019, and the 3 papers presented at CuRIOUS 2019 were carefully reviewed and selected from numerous submissions. The LABELS papers present a variety of approaches for dealing with a limited number of labels, from semi-supervised learning to crowdsourcing. The HAL-MICCAI papers cover a wide set of hardware applications in medical problems, including medical image segmentation, electron tomography, pneumonia detection, etc. The CuRIOUS papers provide a snapshot of the current progress in the field through extended discussions and provide researchers an opportunity to characterize their image registration methods on newly released standardized datasets of iUS-guided brain tumor resection.

With the increasing scalability of semiconductor processes, the higher level of functional integration at the die level, and the system integration of different technologies needed for consumer electronics, System-in-Package (SiP) is the new advanced system integration technology, which integrates (or vertically stacks) within a single package multiple components such as CPU, digital logic, analog/mixed-signal, memory, and passive and discrete components in a single system. System-in-Package: Electrical and Layout Perspectives focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of SiP. It first introduces package technologies, and then presents SiP design flow and design exploration. Finally, the paper discusses details of beyond-die signal and power integrity and physical implementation such as I/O (input/output cell) placement and routing for redistribution layer, escape, and substrate. System-in-Package: Electrical and Layout Perspectives is an invaluable reference for EDA researchers, professionals, and graduate students.