Carbon Nanotubes for Interconnects - Process, Design and Applications (Hardcover, 1st ed. 2017)

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

General

Imprint:	Springer International Publishing AG
Country of origin:	Switzerland
Release date:	July 2016
First published:	2017
Editors:	Aida Todri-Sanial • Jean Dijon • Antonio Maffucci
Dimensions:	235 x 155 x 21mm (L x W x T)
Format:	Hardcover
Pages:	333
Edition:	1st ed. 2017
ISBN-13:	978-3-319-29744-6
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Computing & IT > Computer hardware & operating systems > Computer architecture & logic design > General
LSN:	3-319-29744-9
Barcode:	9783319297446

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