SiC Power Module Design - Performance, robustness and reliability (Hardcover)

High-frequency switching power semiconductor devices are at the heart of power electronic converters. To date, these devices have been dominated by the well-established silicon (Si) technology. However, their intrinsic physical limits are becoming a barrier to achieving higher performance power conversion. Wide Bandgap (WBG) semiconductor devices offer the potential for higher efficiency, smaller size, lighter weight, and/or longer lifetime. Applications in power grid electronics as well as in electromobility are on the rise, but a number of technological bottle-necks need to be overcome if applications are to become more widespread - particularly packaging. This book describes the development of advanced multi-chip packaging solutions for novel WBG semiconductors, specifically silicon carbide (SiC) power MOSFETs. Coverage includes an introduction; multi-chip power modules; module design and transfer to SiC technology; electrothermal, thermo-mechanical, statistical and electromagnetic aspects of optimum module design; high temperature capable SiC power modules; validation technologies; degradation monitoring; and emerging packaging technologies. The book is a valuable reference for researchers and experts in academia and industry.

General

Imprint:	Institution Of Engineering And Technology
Country of origin:	United Kingdom
Series:	Energy Engineering
Release date:	November 2021
First published:	2021
Editors:	Alberto Castellazzi (Professor) • Andrea Irace (Professor of Electronics)
Dimensions:	234 x 156mm (L x W)
Format:	Hardcover
Pages:	300
ISBN-13:	978-1-78561-907-6
Categories:	Books > Professional & Technical > Energy technology & engineering > Electrical engineering > Power generation & distribution Promotions
LSN:	1-78561-907-1
Barcode:	9781785619076

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