Through Silicon Vias - Materials, Models, Design, and Performance (Paperback)

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

General

Imprint:	Crc Press
Country of origin:	United Kingdom
Release date:	June 2020
First published:	2017
Authors:	Brajesh Kumar Kaushik • Vobulapuram Ramesh Kumar • Manoj Kumar Majumder • Arsalan Alam
Dimensions:	234 x 156mm (L x W)
Format:	Paperback
Pages:	216
ISBN-13:	978-0-367-57454-3
Categories:	Books > Professional & Technical > Technology: general issues > Nanotechnology Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Semi-conductors & super-conductors
LSN:	0-367-57454-3
Barcode:	9780367574543

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