Electromigration Modeling at Circuit Layout Level (Paperback, 2013 ed.)

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

General

Imprint:	Springer Verlag, Singapore
Country of origin:	Singapore
Series:	SpringerBriefs in Reliability
Release date:	May 2013
First published:	2013
Authors:	Cher Ming Tan • Feifei He
Dimensions:	235 x 155 x 6mm (L x W x T)
Format:	Paperback
Pages:	103
Edition:	2013 ed.
ISBN-13:	978-981-4451-20-8
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
LSN:	981-4451-20-7
Barcode:	9789814451208

Is the information for this product incomplete, wrong or inappropriate? Let us know about it.

Does this product have an incorrect or missing image? Send us a new image.

Is this product missing categories? Add more categories.

Review This Product

No reviews yet - be the first to create one!