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Joining Processes - An Introduction (Paperback)
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Joining Processes - An Introduction (Paperback)
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Joining Processes An Introduction David Brandon and Wayne D. Kaplan
Technion, Israel Institute of Technology, Israel This is an
introductory text for students of materials science and engineering
interested in the scientific background to the joining and assembly
of components in engineering systems. The principles of joining and
the common methods employed to achieve a reliable joint are covered
in chapters that all conclude with a summary of the points covered,
and a set of problems for individual study, or class discussion. In
the first chapters, thorough introductory overviews are given of
firstly, the mechanical, chemical and physical phenomena related to
surfaces, contacts and joins. In subsequent chapters, any necessary
metallurgical or chemical background is adequately covered to
enable students to understand the basic principles of a variety of
joining methods, microelectronic devices and vacuum assemblies.
Contents: Introduction; Surface Science; The Mechanics of Joining;
Mechanical Bonding; Welding; Weld Metallurgy; Soldering and
Brazing; Metal-ceramic Joints and Diffusion Bonding; Adhesives;
Vacuum Seals; Micro-electronic Packaging.
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