There is currently great interest in the process of diffusion
bonding. The main thrust has been in the joining of advanced
materials such as superplastic alloys, metal matrix composites and
ceramics and, most importantly, to introduce the process into
mass-production operations. Diffusion bonding has also led to
reduced manufacturing costs and weight savings in conventional
materials and developments in hot isostatic pressing have allowed
greater design flexibility. Since the first conference on Diffusion
Bonding, held at Cranfield in 1987, considerable advances have been
made and it was therefore considered appropriate to organise the
Second International Conference on Diffusion Bonding which was held
at Cranfield Institute of Technology on 28 and 29 March 1990. The
meeting provided a forum for the presentation and discussion of
recent developments in Diffusion Bonding and was divided into four
main subject areas: steel bonding and quality control, diffusion
bonding of aluminium alloys, bonding of high temperature materials
and general applications. This structure is retained in the
proceedings. DAVID STEPHENSON vii CONTENTS v Preface
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