Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture (Hardcover)

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.

General

Imprint:	Woodhead Publishing Ltd
Country of origin:	United Kingdom
Series:	Woodhead Publishing Series in Electronic and Optical Materials
Release date:	May 2015
First published:	2015
Authors:	E H Wong • Y.W. Mai
Dimensions:	229 x 152mm (L x W)
Format:	Hardcover
Pages:	482
ISBN-13:	978-1-84569-528-6
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > General
LSN:	1-84569-528-3
Barcode:	9781845695286

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