Microelectromechanical systems (MEMS) radio frequency (RF) switches
have been shown to have excellent electrical performance over a
wide range of frequencies. However, cost-effective packaging
techniques for MEMS switches do not currently exist. This thesis
involves the design of RF-optimized encapsulations consisting of
dielectric and metal layers, and the creation of a novel thin film
encapsulation process to fabricate the encapsulations. The RF
performance of several encapsulation designs are evaluated wit h an
analytical model, full wave electromagnetic simulation, and
laboratory testing. Performance degradation due to parasitic and
reflection losses due to the package is considered, and RF
feed-throughs of the transmission line into and out of the package
are designed and assessed. Ten different encapsulation designs were
created and their RF performance was characterized in terms of
insertion loss, return loss, and isolation. A switch without an
encapsulation and a switch with a dielectric encapsulation were
fabricated and tested by the Air Force Research Laboratory (AFRL),
and the test data was used to verify the data from analytical
modeling and electromagnetic simulation performed in this work.
General
| Imprint: |
Biblioscholar
|
| Country of origin: |
United States |
| Release date: |
November 2012 |
| First published: |
November 2012 |
| Authors: |
Eric D. Marsh
|
| Dimensions: |
246 x 189 x 9mm (L x W x T) |
| Format: |
Paperback - Trade
|
| Pages: |
170 |
| ISBN-13: |
978-1-288-32435-4 |
| Categories: |
Books >
Social sciences >
Education >
General
Promotions
|
| LSN: |
1-288-32435-9 |
| Barcode: |
9781288324354 |
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