Books > Professional & Technical > Mechanical engineering & materials > Production engineering
|
Buy Now
Hybrid Assemblies and Multichip Modules (Hardcover, New)
Loot Price: R4,597
Discovery Miles 45 970
|
|
Hybrid Assemblies and Multichip Modules (Hardcover, New)
Series: Manufacturing Engineering and Materials Processing
Expected to ship within 12 - 17 working days
|
Donate to Against Period Poverty
Total price: R4,617
Discovery Miles: 46 170
|
Providing a description of design considerations from the user's
viewpoint, this detailed reference discusses the materials used in
manufacturing hybrid assemblies and multichip modules -
illustrating how these products are created for a wide range of
applications.;Examining the current state of hybrid assembly
technology, Hybrid Assemblies and Multichip Modules: provides a
thorough overview of substrate materials and metals used for
conductors, addressing multilayer materials and overglazes;
explicates design considerations such as circuit layout, component
placement, thermal management and interface problems; clarifies the
manufacturing techniques used for multi-layer thick-film circuits
and multilayer substrates; and explains soldering and other
attachment methods for discrete components.;Focusing primarily on
electronic assemblies that use ceramic substrates, Hybrid
Assemblies and Multichip Modules should serve as a comprehensive
resource for manufacturing, electrical and electronics, and
automotive engineers; manufacturing managers; hybrid assembly
designers; hybrid assembly users; printed circuit designers,
fabricators and users; and graduate-level students in manufacturing
engineering and electronic packaging courses.
General
Is the information for this product incomplete, wrong or inappropriate?
Let us know about it.
Does this product have an incorrect or missing image?
Send us a new image.
Is this product missing categories?
Add more categories.
Review This Product
No reviews yet - be the first to create one!
|
|
Email address subscribed successfully.
A activation email has been sent to you.
Please click the link in that email to activate your subscription.