0
Your cart

Your cart is empty

Books > Professional & Technical > Mechanical engineering & materials > Production engineering

Buy Now

Hybrid Assemblies and Multichip Modules (Hardcover, New) Loot Price: R4,925
Discovery Miles 49 250
Hybrid Assemblies and Multichip Modules (Hardcover, New): Fred W. Kear

Hybrid Assemblies and Multichip Modules (Hardcover, New)

Fred W. Kear

Series: Manufacturing Engineering and Materials Processing

 (sign in to rate)
Loot Price R4,925 Discovery Miles 49 250 | Repayment Terms: R462 pm x 12*

Bookmark and Share

Expected to ship within 10 - 15 working days

Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.

General

Imprint: Crc Press
Country of origin: United States
Series: Manufacturing Engineering and Materials Processing
Release date: December 1992
First published: 1992
Authors: Fred W. Kear
Dimensions: 234 x 156 x 17mm (L x W x T)
Format: Hardcover
Pages: 296
Edition: New
ISBN-13: 978-0-8247-8466-9
Categories: Books > Professional & Technical > Mechanical engineering & materials > Materials science > General
Books > Professional & Technical > Mechanical engineering & materials > Production engineering > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
Promotions
LSN: 0-8247-8466-9
Barcode: 9780824784669

Is the information for this product incomplete, wrong or inappropriate? Let us know about it.

Does this product have an incorrect or missing image? Send us a new image.

Is this product missing categories? Add more categories.

Review This Product

No reviews yet - be the first to create one!

You might also like..

Closing The Gap - The Fourth Industrial…
Tshilidzi Marwala Paperback R559 Discovery Miles 5 590
Occupational Health and Safety…
Charles D Reese Paperback R1,645 R1,524 Discovery Miles 15 240
Mechanotechnology N3
F.M. Gouws Paperback R428 Discovery Miles 4 280
Risk-Based Reliability Analysis and…
Michael T Todinov Hardcover R3,876 Discovery Miles 38 760
Process Selection - From Design to…
K. G Swift, J.D. Booker Paperback R1,205 Discovery Miles 12 050
Maintenance Strategy
Anthony Kelly Hardcover R2,604 Discovery Miles 26 040
Process Tomography - Principles…
M.S. Beck, Williams Hardcover R1,396 Discovery Miles 13 960
Microgrids: Theory and Practice
Zhang Hardcover R3,019 Discovery Miles 30 190
Engineering Reliability and Risk…
Harish Garg, Mangey Ram Paperback R5,770 Discovery Miles 57 700
Quality Analysis of Additively…
Javad Kadkhodapour, Siegfried Schmauder, … Paperback R4,703 Discovery Miles 47 030
Computational Intelligence in…
Kaushik Kumar, Ganesh M. Kakandikar, … Paperback R3,965 Discovery Miles 39 650
ISO 9001 for all Real Estate Industries…
Jahangir Asadi Hardcover R850 Discovery Miles 8 500

See more

Partners