Microelectronic Interconnections and Assembly (Paperback, Softcover reprint of the original 1st ed. 1998)

MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.

General

Imprint:	Springer
Country of origin:	Netherlands
Series:	NATO Science Partnership Subseries: 3, 54
Release date:	November 2012
First published:	1998
Editors:	G. G. Harman • Pavel Mach
Dimensions:	240 x 160 x 17mm (L x W x T)
Format:	Paperback
Pages:	299
Edition:	Softcover reprint of the original 1st ed. 1998
ISBN-13:	978-9401061599
Categories:	Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Metals technology / metallurgy Books > Professional & Technical > Mechanical engineering & materials > Production engineering > General Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General Books > Professional & Technical > Mechanical engineering & materials > Materials science > Testing of materials > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
LSN:	9401061599
Barcode:	9789401061599

Is the information for this product incomplete, wrong or inappropriate? Let us know about it.

Does this product have an incorrect or missing image? Send us a new image.

Is this product missing categories? Add more categories.

Review This Product

No reviews yet - be the first to create one!