Benefiting from Thermal and Mechanical Simulation in Micro-Electronics (Hardcover, 2000 ed.)

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation GBP/LISTGBP Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.

General

Imprint:	Springer
Country of origin:	Netherlands
Release date:	2001
First published:	2000
Editors:	G.Q. Zhang • L.J. Ernst • O.De Saint Leger
Dimensions:	235 x 155 x 12mm (L x W x T)
Format:	Hardcover
Pages:	192
Edition:	2000 ed.
ISBN-13:	978-0-7923-7278-3
Categories:	Books > Professional & Technical > Industrial chemistry & manufacturing technologies > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > General Promotions
LSN:	0-7923-7278-6
Barcode:	9780792372783

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