Encapsulation Technologies for Electronic Applications (Paperback, 2nd edition)

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic.

General

Imprint:	William Andrew Publishing
Country of origin:	United States
Series:	Materials and Processes for Electronic Applications
Release date:	October 2018
First published:	2019
Authors:	Haleh Ardebili • Jia Wei Zhang • Michael G. Pecht
Series editors:	James J. Licari
Dimensions:	229 x 152mm (L x W)
Format:	Paperback
Pages:	508
Edition:	2nd edition
ISBN-13:	978-0-12-811978-5
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
LSN:	0-12-811978-0
Barcode:	9780128119785

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