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Books > Professional & Technical > Technology: general issues

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Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds (Paperback) Loot Price: R959
Discovery Miles 9 590
Repayment Terms: R90 pm x 12*
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Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds (Paperback): Harjinder Singh, Amandeep Singh Sappal,...

Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds (Paperback)

Harjinder Singh, Amandeep Singh Sappal, Manvinder Sharma

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Loot Price R959 Discovery Miles 9 590 | Repayment Terms: R90 pm x 12*

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General

Imprint: Lap Lambert Academic Publishing
Release date: June 2018
Authors: Harjinder Singh • Amandeep Singh Sappal • Manvinder Sharma
Dimensions: 229 x 152 x 4mm (L x W x T)
Format: Paperback - Trade
Pages: 60
ISBN-13: 978-6139858248
Categories: Books > Professional & Technical > Technology: general issues > General
LSN: 6139858240
Barcode: 9786139858248

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