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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials
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Advanced Flip Chip Packaging (Hardcover, 2012)
Loot Price: R5,228
Discovery Miles 52 280
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Advanced Flip Chip Packaging (Hardcover, 2012)
Expected to ship within 18 - 22 working days
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Advanced Flip Chip Packaging presents past, present and future
advances and trends in areas such as substrate technology, material
development, and assembly processes. Flip chip packaging is now in
widespread use in computing, communications, consumer and
automotive electronics, and the demand for flip chip technology is
continuing to grow in order to meet the need for products that
offer better performance, are smaller, and are environmentally
sustainable.
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