Advanced Flip Chip Packaging (Hardcover, 2012)

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Release date:	March 2013
First published:	2010
Editors:	Ho-Ming Tong • Yi-Shao Lai • C.P. Wong
Dimensions:	235 x 155 x 26mm (L x W x T)
Format:	Hardcover
Pages:	560
Edition:	2012
ISBN-13:	978-1-4419-5767-2
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
LSN:	1-4419-5767-7
Barcode:	9781441957672

Is the information for this product incomplete, wrong or inappropriate? Let us know about it.

Does this product have an incorrect or missing image? Send us a new image.

Is this product missing categories? Add more categories.

Review This Product

No reviews yet - be the first to create one!