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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials

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Advanced Flip Chip Packaging (Hardcover, 2012) Loot Price: R5,963
Discovery Miles 59 630
Repayment Terms: R559 pm x 12*
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Advanced Flip Chip Packaging (Hardcover, 2012): Ho-Ming Tong, Yi-Shao Lai, C.P. Wong

Advanced Flip Chip Packaging (Hardcover, 2012)

Ho-Ming Tong, Yi-Shao Lai, C.P. Wong

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Loot Price R5,963 Discovery Miles 59 630 | Repayment Terms: R559 pm x 12*

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Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

General

Imprint: Springer-Verlag New York
Country of origin: United States
Release date: March 2013
First published: 2010
Editors: Ho-Ming Tong • Yi-Shao Lai • C.P. Wong
Dimensions: 235 x 155 x 26mm (L x W x T)
Format: Hardcover
Pages: 560
Edition: 2012
ISBN-13: 978-1-4419-5767-2
Categories: Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
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LSN: 1-4419-5767-7
Barcode: 9781441957672

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