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3D Stacked Chips - From Emerging Processes to Heterogeneous Systems (Hardcover, 1st ed. 2016) Loot Price: R2,019
Discovery Miles 20 190
Repayment Terms: R189 pm x 12*
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3D Stacked Chips - From Emerging Processes to Heterogeneous Systems (Hardcover, 1st ed. 2016): Ibrahim (Abe) M Elfadel, Gerhard...

3D Stacked Chips - From Emerging Processes to Heterogeneous Systems (Hardcover, 1st ed. 2016)

Ibrahim (Abe) M Elfadel, Gerhard Fettweis

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List price R2,650 Loot Price R2,019 Discovery Miles 20 190 | Repayment Terms: R189 pm x 12* You Save R631 (24%)

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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

General

Imprint: Springer International Publishing AG
Country of origin: Switzerland
Release date: May 2016
First published: 2016
Editors: Ibrahim (Abe) M Elfadel • Gerhard Fettweis
Dimensions: 235 x 155 x 26mm (L x W x T)
Format: Hardcover - Cloth over boards
Pages: 339
Edition: 1st ed. 2016
ISBN-13: 978-3-319-20480-2
Categories: Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
Books > Computing & IT > Computer hardware & operating systems > Computer architecture & logic design > General
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LSN: 3-319-20480-7
Barcode: 9783319204802

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