3D Stacked Chips - From Emerging Processes to Heterogeneous Systems (Hardcover, 1st ed. 2016)

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

General

Imprint:	Springer International Publishing AG
Country of origin:	Switzerland
Release date:	May 2016
First published:	2016
Editors:	Ibrahim (Abe) M Elfadel • Gerhard Fettweis
Dimensions:	235 x 155 x 26mm (L x W x T)
Format:	Hardcover - Cloth over boards
Pages:	339
Edition:	1st ed. 2016
ISBN-13:	978-3-319-20480-2
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Computing & IT > Computer hardware & operating systems > Computer architecture & logic design > General
LSN:	3-319-20480-7
Barcode:	9783319204802

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