Thermal Conductivity 20 (Paperback, Softcover reprint of the original 1st ed. 1989)

The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks and grew out of the needs of researchers in the field. The Conferences were held annually from 1961 to 1973 and have been held biennially since 1975 when our Center for Informa tion and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. -These Conferences provide a broadly based forum for researchers actively working on the thermal con ductivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible. arti ficial barriers between disciplines and gather together in increasing num bers without the need of national publicity and continuing funding support. when they see something worthwhile going on. It is believed that this ser ies of Conferences not only will grow stronger. but will set an example for researchers in other fields on how to jointly attack their own problem areas."

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Release date:	September 2011
First published:	1989
Authors:	J. R. Jr. Thomas • D.P.H. Hasselman
Dimensions:	244 x 170 x 23mm (L x W x T)
Format:	Paperback
Pages:	440
Edition:	Softcover reprint of the original 1st ed. 1989
ISBN-13:	978-1-4612-8069-9
Categories:	Books > Professional & Technical > Mechanical engineering & materials > Materials science > Testing of materials > General
LSN:	1-4612-8069-9
Barcode:	9781461280699

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