Advanced Liquid Metal Cooling For Chip, Device And System (Hardcover)

This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category - liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system.With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry.

General

Imprint:	World Scientific Publishing Co Pte Ltd
Country of origin:	Singapore
Release date:	April 2022
Authors:	Jing Liu
Format:	Hardcover
Pages:	960
ISBN-13:	978-981-12-4585-5
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
LSN:	981-12-4585-1
Barcode:	9789811245855

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