Semiconductor Advanced Packaging (Hardcover, 1st ed. 2021)

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

General

Imprint:	Springer Verlag, Singapore
Country of origin:	Singapore
Release date:	May 2021
First published:	2021
Authors:	John H. Lau
Dimensions:	235 x 155 x 41mm (L x W x T)
Format:	Hardcover
Pages:	498
Edition:	1st ed. 2021
ISBN-13:	978-981-16-1375-3
Categories:	Books > Professional & Technical > Mechanical engineering & materials > Production engineering > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Semi-conductors & super-conductors
LSN:	981-16-1375-3
Barcode:	9789811613753

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