Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Semi-conductors & super-conductors
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Semiconductor Advanced Packaging (Hardcover, 1st ed. 2021)
Loot Price: R4,294
Discovery Miles 42 940
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Semiconductor Advanced Packaging (Hardcover, 1st ed. 2021)
Expected to ship within 12 - 17 working days
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The book focuses on the design, materials, process, fabrication,
and reliability of advanced semiconductor packaging components and
systems. Both principles and engineering practice have been
addressed, with more weight placed on engineering practice. This is
achieved by providing in-depth study on a number of major topics
such as system-in-package, fan-in wafer/panel-level chip-scale
packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D,
2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer
bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric
materials for high speed and frequency. The book can benefit
researchers, engineers, and graduate students in fields of
electrical engineering, mechanical engineering, materials sciences,
and industry engineering, etc.
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