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Books > Computing & IT > Computer hardware & operating systems > Computer architecture & logic design
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3D Interconnect Architectures for Heterogeneous Technologies - Modeling and Optimization (Hardcover, 1st ed. 2022)
Loot Price: R2,982
Discovery Miles 29 820
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3D Interconnect Architectures for Heterogeneous Technologies - Modeling and Optimization (Hardcover, 1st ed. 2022)
Expected to ship within 12 - 17 working days
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This book describes the first comprehensive approach to the
optimization of interconnect architectures in 3D systems on chips
(SoCs), specially addressing the challenges and opportunities
arising from heterogeneous integration. Readers learn about the
physical implications of using heterogeneous 3D technologies for
SoC integration, while also learning to maximize the 3D-technology
gains, through a physical-effect-aware architecture design. The
book provides a deep theoretical background covering all
abstraction-levels needed to research and architect tomorrow's
3D-integrated circuits, an extensive set of optimization methods
(for power, performance, area, and yield), as well as an
open-source optimization and simulation framework for fast
exploration of novel designs.
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