3D Interconnect Architectures for Heterogeneous Technologies - Modeling and Optimization (Hardcover, 1st ed. 2022)

This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow's 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.

General

Imprint:	Springer Nature Switzerland AG
Country of origin:	Switzerland
Release date:	June 2022
First published:	2022
Authors:	Lennart Bamberg • Jan Moritz Joseph • Alberto Garcia Ortiz • Thilo Pionteck
Dimensions:	235 x 155mm (L x W)
Format:	Hardcover
Pages:	395
Edition:	1st ed. 2022
ISBN-13:	978-3-03-098228-7
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Computing & IT > Computer hardware & operating systems > Computer architecture & logic design > General
LSN:	3-03-098228-9
Barcode:	9783030982287

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