Designing TSVs for 3D Integrated Circuits (Paperback, 2013)

This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Series:	SpringerBriefs in Electrical and Computer Engineering
Release date:	September 2012
First published:	2013
Authors:	Nauman Khan • Soha Hassoun
Dimensions:	235 x 155 x 10mm (L x W x T)
Format:	Paperback
Pages:	76
Edition:	2013
ISBN-13:	978-1-4614-5507-3
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Computing & IT > Computer hardware & operating systems > Computer architecture & logic design > General
LSN:	1-4614-5507-3
Barcode:	9781461455073

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