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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Microprocessors

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Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition (Hardcover, 6th edition) Loot Price: R4,010
Discovery Miles 40 100
Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition (Hardcover, 6th edition): Peter Van Zant

Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition (Hardcover, 6th edition)

Peter Van Zant

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Loot Price R4,010 Discovery Miles 40 100 | Repayment Terms: R376 pm x 12*

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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The most complete, current guide to semiconductor processingFully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors. State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry. COVERAGE INCLUDES: The semiconductor industry Properties of semiconductor materials and chemicals Crystal growth and silicon wafer preparation Wafer fabrication and packaging Contamination control Productivity and process yields Oxidation The ten-step patterning process--surface preparation to exposure; developing to final inspection Next generation lithography Doping Layer deposition Metallization Process and device evaluation The business of wafer fabrication Devices and integrated circuit formation Integrated circuits Packaging

General

Imprint: McGraw-Hill Professional
Country of origin: United States
Release date: December 2013
First published: 2014
Authors: Peter Van Zant
Dimensions: 241 x 196 x 37mm (L x W x T)
Format: Hardcover - Cloth over boards
Pages: 576
Edition: 6th edition
ISBN-13: 978-0-07-182101-8
Categories: Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Microprocessors
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LSN: 0-07-182101-5
Barcode: 9780071821018

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