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Testing of Interposer-Based 2.5D Integrated Circuits (Hardcover, 1st ed. 2017) Loot Price: R3,335
Discovery Miles 33 350
Repayment Terms: R313 pm x 12*
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Testing of Interposer-Based 2.5D Integrated Circuits (Hardcover, 1st ed. 2017): Ran Wang, Krishnendu Chakrabarty

Testing of Interposer-Based 2.5D Integrated Circuits (Hardcover, 1st ed. 2017)

Ran Wang, Krishnendu Chakrabarty

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Loot Price R3,335 Discovery Miles 33 350 | Repayment Terms: R313 pm x 12*

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This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.

General

Imprint: Springer International Publishing AG
Country of origin: Switzerland
Release date: March 2017
First published: 2017
Authors: Ran Wang • Krishnendu Chakrabarty
Dimensions: 235 x 155 x 13mm (L x W x T)
Format: Hardcover
Pages: 182
Edition: 1st ed. 2017
ISBN-13: 978-3-319-54713-8
Categories: Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
Books > Computing & IT > Computer hardware & operating systems > Computer architecture & logic design > General
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LSN: 3-319-54713-5
Barcode: 9783319547138

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