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More-than-Moore 2.5D and 3D SiP Integration (Hardcover, 1st ed. 2017)
Loot Price: R4,274
Discovery Miles 42 740
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More-than-Moore 2.5D and 3D SiP Integration (Hardcover, 1st ed. 2017)
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This book presents a realistic and a holistic review of the
microelectronic and semiconductor technology options in the post
Moore's Law regime. Technical tradeoffs, from architecture down to
manufacturing processes, associated with the 2.5D and 3D
integration technologies, as well as the business and product
management considerations encountered when faced by disruptive
technology options, are presented. Coverage includes a discussion
of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and
Outsourced Assembly and Test (OSAT) barriers to implementation of
disruptive technology options. This book is a must-read for any IC
product team that is considering getting off the Moore's Law track,
and leveraging some of the More-than-Moore technology options for
their next microelectronic product.
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