More-than-Moore 2.5D and 3D SiP Integration (Hardcover, 1st ed. 2017)

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore's Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore's Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.

General

Imprint:	Springer International Publishing AG
Country of origin:	Switzerland
Release date:	February 2017
First published:	2017
Authors:	Riko Radojcic
Dimensions:	235 x 155 x 13mm (L x W x T)
Format:	Hardcover
Pages:	182
Edition:	1st ed. 2017
ISBN-13:	978-3-319-52547-1
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Computing & IT > Computer hardware & operating systems > Computer architecture & logic design > General Promotions
LSN:	3-319-52547-6
Barcode:	9783319525471

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